Patents by Inventor Shih-Yi Su

Shih-Yi Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for creating new via
    Patent number: 7647566
    Abstract: A method for creating new vias in an integrated circuit chip. The method automatically creates a plurality of new vias around an original via for electrically connecting two metal layers to each other in circuit layout data of the integrated circuit chip. The new vias also electrically connect the two metal layers to each other. According to the new vias, the probability of certainly electrically connecting the two metal layers of the integrated circuit chip to each other can be increased when the integrated circuit chip is being manufactured.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: January 12, 2010
    Assignee: Himax Technologies Limited
    Inventor: Shih-Yi Su
  • Method for creating new via
    Publication number: 20070162883
    Abstract: A method for creating new vias in an integrated circuit chip. The method automatically creates a plurality of new vias around an original via for electrically connecting two metal layers to each other in circuit layout data of the integrated circuit chip. The new vias also electrically connect the two metal layers to each other. According to the new vias, the probability of certainly electrically connecting the two metal layers of the integrated circuit chip to each other can be increased when the integrated circuit chip is being manufactured.
    Type: Application
    Filed: January 4, 2007
    Publication date: July 12, 2007
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventor: Shih-Yi Su