Abstract: A probe card for detecting a wafer. The probe card includes a light-output element, which is connected to a positioning element. The light-output element is set within a through hole of an electrical detection substrate. The light-output element is connected to a light source controller by an optical fiber, thereby an output light can be transmitted from the light source controller to the light-output element. The positioning element can move the light-output element in three-dimensional space or adjust an emitting angle from an axis of the light-output element. Therefore, an optical measurement and an electrical measurement can be implemented at the same time in the silicon photonic wafer test.

Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.

Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.