Abstract: A semiconductor structure includes a via in contact with a conductive line and extending through a first etch stop layer, a first inter-metal dielectric layer, and a second etch stop layer. The second etch stop layer is disposed over the first inter-metal dielectric layer, and the first inter-metal dielectric layer is disposed over the first etch stop layer. The semiconductor structure also includes a trench in contact with the via and extending through an insulating layer and a second inter-metal dielectric layer. The second inter-metal dielectric layer is disposed over the insulating layer which is disposed over the second etch stop layer.

Abstract: Semiconductor devices, methods of manufacturing the semiconductor device and tools are disclosed herein. Some methods include providing an electrostatic chuck and placing an edge ring adjacent to the electrostatic chuck. The electrostatic chuck includes a first electrode to generate a sheath at a first distance over the electrostatic chuck. The edge ring includes a coil and a second electrode to generate an electric field control to maintain a portion of the sheath over the edge ring in a coplanar orientation with the portion of the sheath over the electrostatic chuck.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: A method of forming a semiconductor device structure is disclosed. First and second etch stop layers are formed overlying a semiconductor structure having a conductive feature formed therein. A dielectric layer is formed overlying the second etch stop layer, and a hard mask, that comprises a tungsten-based material, is formed overlying the dielectric layer, and patterned. A resist layer is formed over the patterned hard mask. Using the patterned resist layer as a mask, a first etching process is performed to form a via opening that extends partially through the dielectric layer. Using the patterned hard mask as an etch mask, a second etching process (e.g., dry etching process) is performed to extend the via opening through the second etch stop layer, and a third etching process (e.g., wet etching process) is performed to extend the via opening through the first etch stop layer to reach the conductive feature.

Abstract: A method includes forming a transistor comprising a source/drain region and a gate electrode, forming a source/drain contact plug over and electrically connecting to the source/drain region, forming a first inter-layer dielectric over the source/drain contact plug, forming an etch stop layer over the first inter-layer dielectric, etching the etch stop layer to form a first via opening, forming a second inter-layer dielectric over the first inter-layer dielectric, performing an etching process, so that the second inter-layer dielectric is etched to form a trench, and the first via opening in the etch stop layer is extended into the first inter-layer dielectric to reveal the source/drain contact plug, and filling the trench and the first via opening in common processes to form a metal line and a via, respectively.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the conductive line and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: A method includes depositing an inter-metal dielectric (IMD) layer over a conductive line. A via opening is formed in the IMD layer and directly over the conductive line. A width of the conductive line is greater than a width of the via opening. An overlay measurement is performed. The overlay measurement includes obtaining a backscattered electron image of the via opening and the conductive line and determining an overlay between the via opening and the conductive line according to the backscattered electron image.

Abstract: Semiconductor devices, methods of manufacturing the semiconductor device and tools are disclosed herein. Some methods include providing an electrostatic chuck and placing an edge ring adjacent to the electrostatic chuck. The electrostatic chuck includes a first electrode to generate a sheath at a first distance over the electrostatic chuck. The edge ring includes a coil and a second electrode to generate an electric field control to maintain a portion of the sheath over the edge ring in a coplanar orientation with the portion of the sheath over the electrostatic chuck.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: Examples of fabricating an integrated circuit device are disclosed herein. In an embodiment, an integrated circuit workpiece is received that includes a conductive interconnect feature. A first Inter-Level Dielectric (ILD) layer is formed on the conductive interconnect feature, and a second ILD layer is formed on the first ILD layer. A hard mask is formed on the second ILD layer. A via recess is etched extending through the first ILD layer, the second ILD layer and the hard mask to expose the conductive interconnect feature. The etching includes providing a passivation agent that reacts with a material of the hard mask to reduce etchant sensitivity.

Abstract: A ringtone assignment system and method are provided. The method includes steps of recording a multimedia ringtone via a first communication device, transmitting a communication linking request to a communication exchange host, transmitting the communication linking request to a second communication device via the communication exchange host to enable the second communication device to feed back ringtone format information supported by the second communication device according to the communication linking request, transmitting the ringtone format information to the first communication device via the communication exchange host to enable the first communication device to code the multimedia ringtone according to the ringtone format information, transmitting the multimedia ringtone from the first communication device to the second communication device, and then decoding and playing the multimedia ringtone by the second communication device.

Abstract: A method for physiological signal analysis and its system and a computer program product storing a physiological signal analysis program are provided. Physiological signals of a subject are collected for a user to provide a detection opinion for the physiological signals in order to generate syndrome recognition parameters and syndrome weight parameters such that the collected physiological signals are analyzed and determined. The invention performs detection determination by means of combining the physiological signals of the subject and referencing to an analysis opinion from the user. Therefore, an output detection result may be believed by both doctors and patients with effectively improved accuracy of analysis result to improve the efficiency of the user in diagnosis and treatment.

Abstract: A network-wide service controller comprises a monitoring device, an intelligent device, and a management device. The monitoring device is configured to monitor a state of at least one network. The intelligent device is configured to determine a path within the at least one network according to the state of the at least one network. The intelligent device is further configured to receive an instruction from a user and convert the instruction into a lower-level instruction. The management device is configured to analyze the lower-level instruction from the intelligent device and control forwarding of packets according to a result of analysis of the lower-level instruction and the path determined by the intelligent device.

Abstract: A method for physiological signal analysis and its system and a computer program product storing a physiological signal analysis program are provided. Physiological signals of a subject are collected for a user to provide a detection opinion for the physiological signals in order to generate syndrome recognition parameters and syndrome weight parameters such that the collected physiological signals are analyzed and determined. The invention performs detection determination by means of combining the physiological signals of the subject and referencing to an analysis opinion from the user. Therefore, an output detection result may be believed by both doctors and patients with effectively improved accuracy of analysis result to improve the efficiency of the user in diagnosis and treatment.

Abstract: A packaging substrate is provided, which includes: a laminated body; first, second and third conductive pads formed on a surface of the laminated body so as for conductive bumps to be respectively mounted thereon, wherein the third conductive pad is positioned outside of an area between projections of the conductive bumps on the first and second conductive pads on the surface of the laminated body; first, second and third conductive vias formed in the laminated body and electrically connected to the first, second and third conductive pads, respectively; and first, second and third internal conductive traces formed in the laminated body and electrically connected to the first, second and third conductive vias, respectively, thereby preventing bridging from occurring between the conductive bumps and the conductive traces and overcoming non-wetting of the conductive bumps caused by a solder mask layer.

Abstract: A ringtone assignment system and method are provided. The method includes steps of recording a multimedia ringtone via a first communication device, transmitting a communication linking request to a communication exchange host, transmitting the communication linking request to a second communication device via the communication exchange host to enable the second communication device to feed back ringtone format information supported by the second communication device according to the communication linking request, transmitting the ringtone format information to the first communication device via the communication exchange host to enable the first communication device to code the multimedia ringtone according to the ringtone format information, transmitting the multimedia ringtone from the first communication device to the second communication device, and then decoding and playing the multimedia ringtone by the second communication device.

Abstract: A method for information security comprises determining by a first processor whether web content includes malicious software by matching the web content with at least one recorded threat, determining by the first processor whether the quantity of malicious software reaches a threshold, processing by a second processor the malicious software with a cryptographic protocol to generate a processing result, if the quantity of malicious software reaches the threshold, and generating a message indicating a threat in response to the processing result.

Abstract: A retractable handle assembly for luggage case is disclosed. In a pulling operation, press a push button to unlock a locking device such that a damping device thereunder is free to damply extend upward a predetermined distance in a substantially stable speed for easing a pulling of the handle thereafter.

Abstract: A seamless handle grip assembly mounted on a single pulling rod of luggage is provided. The assembly comprises a tube a top grip section, a spring depressible push button a hollow, cylindrical left member inserted into a left portion of the tube, a hollow, cylindrical right member inserted into a right portion of the tube to matingly couple to the left member, a bottom grip section threadedly secured to the top grip section with the tube fastened therebetween, and a rod inserted upwardly through the bottom grip section into the tube and the spring to fixedly couple to the push button.