Patents by Inventor Shih-Yu Chen

Shih-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10681936
    Abstract: An electronic cigarette includes a power supply device, an atomizer, a liquid storage structure, a fluid transportation device and a sensing unit. The atomizer includes an electric heater. The liquid storage structure includes a passageway and a liquid container for storing cigarette liquid. The fluid transportation device is in communication with the liquid container and the atomizer for transferring the cigarette liquid to the atomizer at a certain amount. Consequently, an atomized vapor is generated. The sensing unit includes an airflow sensor and an air pressure sensor. The power supply device is selectively enabled or disabled according to a result of detecting the airflow by the airflow sensor, and the air pressure sensor issues a detection signal to the control module according to a result of detecting a pressure of the airflow so as to adjust a speed of atomizing the cigarette liquid and the speed of providing the cigarette liquid.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: June 16, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Jia-Yu Liao, Li-Pang Mo, Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai
  • Patent number: 10685868
    Abstract: A method of fabricating a contact hole includes the steps of providing a conductive line, a mask layer covering and contacting the conductive line, a high-k dielectric layer covering and contacting the mask layer, and a first silicon oxide layer covering and contacting the high-k dielectric layer, wherein the high-k dielectric layer includes a first metal oxide layer, a second metal oxide layer and a third metal oxide layer stacked from bottom to top. A dry etching process is performed to etch the first silicon oxide layer, the high-k dielectric layer, and the mask layer to expose the conductive line and form a contact hole. Finally, a wet etching process is performed to etch the first silicon oxide layer, the third metal oxide layer and the second metal oxide layer to widen the contact hole, and the first metal oxide layer remains after the wet etching process.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: June 16, 2020
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Feng-Yi Chang, Shih-Fang Tzou, Fu-Che Lee, Hsin-Yu Chiang, Yu-Ching Chen
  • Patent number: 10687417
    Abstract: An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a base and an air pump. The base includes a passage, an introduction opening and a discharge opening. The electronic component is covered by the base. The electronic component is disposed within the passage. The air pump is fixed on the base and sealing the edge of the introduction opening. When the air pump is enabled, an ambient air is introduced into the passage through the introduction opening to remove the heat from the electronic component, and the air heated by the electronic component is exhausted through the discharge opening.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 16, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Shih-Chang Chen, Jia-Yu Liao, Yung-Lung Han, Chi-Feng Huang
  • Patent number: 10680157
    Abstract: A driving system includes a voltage conversion module, a switching module, a detecting module, a voltage dividing module and a microcontroller. The voltage conversion module converts a first DC voltage into a second DC voltage. The switching module converts the second DC voltage into an AC voltage so as to drive a piezoelectric actuator of a piezoelectric pump. The detecting module includes a feedback circuit and a gas pressure sensor, wherein the feedback circuit detects an electric power reference value of the switching module, and the gas pressure sensor detects the gas pressure value of the piezoelectric pump. The microcontroller acquires a working frequency according to the electric power reference value so as to operate the piezoelectric actuator at the working frequency. The microcontroller controls the voltage conversion module to adjust the output voltage. Consequently, a gas pressure in the piezoelectric pump is correspondingly adjusted.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 9, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Shih-Chang Chen, Jia-Yu Liao, Chi-Feng Huang, Wei-ming Lee, Yung-Lung Han
  • Patent number: 10672499
    Abstract: A flash memory controller is suitable for a NAND flash memory and a voltage supply circuit. The voltage supply circuit supplies a current to the flash memory. The flash memory controller includes a flash control circuit, a current sensing circuit, and a processor. The flash control circuit is configured to control an operation of the flash memory. The current sensing circuit is configured to measure the current consumed by the flash memory during its operation, and output a current value. The processor is configured to output a control signal based on the current value. Therefore, the flash memory controller can instantly obtain a current value consumed during the operation of flash memory, and determine, based on the current value, whether the flash memory runs normally. A storage apparatus having the flash memory controller can instantly determine whether the flash memory runs normally.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 2, 2020
    Assignee: RAYMX MICROELECTRONICS CORP.
    Inventors: Shih-Fu Huang, Shu-Min Lin, Jo-Hua Wu, Cheng-Yu Chen
  • Patent number: 10662938
    Abstract: A fluid transportation device comprises a valve main body, a valve chamber base, a valve membrane, an actuator and a cover body. The valve main body comprises an inlet passage and an outlet passage. The valve chamber base comprises an inlet valve passage, an outlet valve passage and a compressible chamber communicating therewith. The valve membrane is arranged between the valve main body and the valve chamber base, having two valve plates respectively form a valve switch structure which seal the inlet valve passage and the outlet valve passage. The actuator covers the compressible chamber. The cover body covers the actuator and has a plurality of screw holes, which are corresponding to the penetration holes of the valve main body, the valve chamber base and the actuator, and several locking elements are inserting the penetration holes and locked with the screw holes to assemble the fluid transportation device.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: May 26, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Jia-Yu Liao, Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han
  • Patent number: 10658315
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20200144208
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Application
    Filed: December 26, 2019
    Publication date: May 7, 2020
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20200142562
    Abstract: A touch system includes a touch panel; an active pen configured to generate a signal; and a touch controller electrically connected to the touch panel and configured to detect the signal. When the touch controller supports at least two protocols, a protocol of the touch controller is automatically switched to one of the at least two protocols. The active pen automatically detects the one of the at least two protocols, and a protocol of the active pen is switched to the one of the at least two protocols.
    Type: Application
    Filed: October 28, 2019
    Publication date: May 7, 2020
    Applicant: Silicon Integrated Systems Corp.
    Inventors: Han-Ning CHEN, Shih-Chan HUANG, Chien-Yu CHIANG, Kai-Chun CHUANG, Chih-Sheng CHOU
  • Publication number: 20200140339
    Abstract: Doped titanium niobate is provided, which has a chemical structure of Ti(1-x)M1xNb(2-y)M2yO(7-z)Qz or Ti(2-x?)M1x?Nb(10-y?)M2y?O(29-z?)Qz?, wherein M1 is Li, Mg, or a combination thereof; M2 is Fe, Mn, V, Ni, Cr, or a combination thereof; Q is F, Cl, Br, I, S, or a combination thereof; 0?x?0.15; 0?y?0.15; 0.01?z?2; 0?x??0.3; 0?y??0.9; and 0.01?z??8.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 7, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yu KO, Po-Yang HUNG, Chi-Ju CHENG, Shih-Chieh LIAO, Yung-Ting FAN, Jin-Ming CHEN
  • Publication number: 20200135610
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor includes a substrate, a block bonded on the substrate, a first die bonded on the block, a second die disposed over the first die, and a heat spreader covering the block and having a surface facing toward and proximal to the block. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: CHI-HSI WU, WENSEN HUNG, TSUNG-SHU LIN, SHIH-CHANG KU, TSUNG-YU CHEN, HUNG-CHI LI
  • Publication number: 20200135692
    Abstract: A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component is disposed on the redistribution structure and includes a concave portion for receiving the at least one semiconductor device and an extending portion connected to the concave portion and contacting the redistribution structure, wherein the concave portion contacts the at least one semiconductor device. The encapsulating material is disposed over the redistribution structure, wherein the encapsulating material fills the concave portion and encapsulates the at least one semiconductor device.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo
  • Patent number: 10634295
    Abstract: An LED light source module includes a LED board, an optical reflector, a water-proof cover and a lamp pole. The optical reflector furnished above the LED board has a plurality of optical reflecting surfaces that are corresponding to those LED light sources making them irradiate upward. The waterproof cover, being in bowl shape, has its open end which is connected to the LED board. The optical reflector is furnished between the waterproof cover and the LED board. The lamp pole, being in hollow shape, has a power supply furnished therein. Both ends of the lamp pole are connected to the LED board and the power supply socket respectively.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: April 28, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shih-Hao Hua, Chao-Pin Chen, Te-Yu Chien
  • Patent number: 10625447
    Abstract: A molding device includes a lower mold seat including a lower mounting portion, a lower die core assembly mounted in the lower mounting portion and including a lower die core unit defining a mold cavity, an upper mold seat including an upper mounting portion, an upper die core assembly mounted in the upper mounting portion and including an upper die core unit covering the mold cavity, and upper and lower heating units respectively including upper and lower high-frequency heating members respectively inducing eddy current in at least one of the lower die core unit and the lower mold seat and at least one of the upper die core unit and the upper mold seat.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: April 21, 2020
    Assignee: Pou Chen Corporation
    Inventors: Hsiang-Yu Huang, Shih-Chia Lin, Hung-Wu Hsieh, Ju-Cheng Chen, Tsung-Wei Kuo
  • Patent number: 10629734
    Abstract: A method of fabricating a fin structure with tensile stress includes providing a structure divided into an N-type transistor region and a P-type transistor region. Next, two first trenches and two second trenches are formed in the substrate. The first trenches define a fin structure. The second trenches segment the first trenches and the fin. Later, a flowable chemical vapor deposition is performed to form a silicon oxide layer filling the first trenches and the second trenches. Then, a patterned mask is formed only within the N-type transistor region. The patterned mask only covers the silicon oxide layer in the second trenches. Subsequently, part of the silicon oxide layer is removed to make the exposed silicon oxide layer lower than the top surface of the fin structure by taking the patterned mask as a mask. Finally, the patterned mask is removed.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: April 21, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Kai-Lin Lee, Zhi-Cheng Lee, Wei-Jen Chen, Ting-Hsuan Kang, Ren-Yu He, Hung-Wen Huang, Chi-Hsiao Chen, Hao-Hsiang Yang, An-Shih Shih, Chuang-Han Hsieh
  • Patent number: 10619631
    Abstract: A miniature pneumatic device includes a miniature fluid control device and a miniature valve device. The miniature fluid control device includes a gas inlet plate, a resonance plate, a piezoelectric actuator and a gas collecting plate. A first chamber is formed between the resonance plate and the piezoelectric actuator. The miniature valve device includes a valve film and a gas outlet plate. The valve film and the gas outlet plate are stacked on the gas collecting plate. An area of the gas outlet plate is smaller than an area of the gas collecting plate. An adhesive-coating space is defined between four edges of the gas outlet plate and the gas collecting plate. A sealing adhesive is filled in the adhesive-coating space to completely seal a periphery region of the valve film. The first surface and the second surface of the valve film comprise sticking areas.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: April 14, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Shih-Chang Chen, Jia-Yu Liao, Jheng-Wei Chen, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai
  • Patent number: 10620106
    Abstract: A particulate matter measuring device includes a gas transporting actuator, a micro particle sensor and a laser module. The micro particle sensor is disposed corresponding in position to the gas transporting actuator. The laser module is disposed between the gas transporting actuator and the micro particle sensor and emits a laser beam between the gas transporting actuator and the micro particle sensor. The air flowing between the gas transporting actuator and the micro particle sensor is irradiated by the laser beam. The micro particle sensor analyzes sizes of suspended particles in the air and calculates concentrations of the suspended particles. The air is ejected at high speed by the gas transporting actuator to perform a cleaning operation on a surface of the micro particle sensor so as to remove the suspended particles on the surface of the micro particle sensor and maintain accuracy of the micro particle sensor.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: April 14, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Chiu-Lin Lee, Hsuan-Kai Chen, Wei-Ming Lee
  • Patent number: 10615858
    Abstract: A communication system and operating method thereof are provided. The communication system includes an intelligent antenna unit which includes a plurality of antennas, an antenna selecting unit, one or more signal processing units and a control unit. The control unit is configured to: set one or more antenna-sectors from the antennas, each of the antenna-sectors includes one or more antennas selected from the antennas. And set a plurality of antenna-sector configurations, each of the antenna-sector configurations includes one or more sectors configured to the signal processing units, wherein the sectors are selected from the antenna-sectors. The control unit selects one of the antenna-sector configurations to operate communication transmission of a user equipment, and each signal processing unit configured to each sector of the selected antenna-sector configuration operating beam sweeping based on a number of antenna beam deployed to the configured each sector.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: April 7, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shih-Hao Fang, Jen-Yuan Hsu, Chih-Yu Chen, Hsien-Wen Chang
  • Patent number: 10615329
    Abstract: A piezoelectric actuator includes a suspension plate, a piezoelectric ceramic plate, an outer frame and a bracket. The suspension plate is permitted to undergo a curvy vibration from a middle portion to a periphery portion. The piezoelectric ceramic plate is attached on the suspension plate. When a voltage is applied to the piezoelectric ceramic plate, the suspension plate is driven to undergo the curvy vibration. The outer frame is arranged around the suspension plate. The bracket is connected between the suspension plate and the outer frame for elastically supporting the suspension plate, and includes an intermediate part formed in a vacant space between the suspension plate and the outer frame and in parallel with the outer frame and the suspension plate, a first connecting part arranged between the intermediate part and the suspension plate, and a second connecting part arranged between the intermediate part and the outer frame.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 7, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han, Jia-Yu Liao, Shou-Hung Chen, Che-Wei Huang, Hung-Hsin Liao, Chao-Chih Chen, Jheng-Wei Chen, Ying-Lun Chang, Chia-Hao Chang, Wei-Ming Lee
  • Publication number: 20200107427
    Abstract: A droplet generator assembly includes a storage tank, a refill system, a droplet generator, and a temperature control system. The storage tank is configured to store a target material. The refill system is connected to the storage tank. The droplet generator includes a reservoir and a nozzle connected to the reservoir, in which the droplet generator is connected to the refill system, and the refill system is configured to deliver the target material to the reservoir. The temperature control system is adjacent to the refill system or the reservoir.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 2, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yu TU, Yu-Kuang SUN, Shao-Hua WANG, Han-Lung CHANG, Hsiao-Lun CHANG, Li-Jui CHEN, Po-Chung CHENG, Cheng-Hao LAI, Hsin-Feng CHEN, Wei-Shin CHENG, Ming-Hsun TSAI, Yen-Hsun CHEN