Abstract: A method for handling a display control of a microprocessor in an electronic device includes: receiving a display trigger signal; and controlling a panel device in the electronic device to display a content, in response to the display trigger signal; wherein a central processing unit (CPU) in the electronic device is in a power off state, when controlling the panel device to display the content.

Abstract: The present disclosure relates to adaptively overlapping redo writes. A log writer, while operating in a thin mode, may assign a first log writer group of a plurality of log writer groups to write one or more first redo log records to an online redo log in response to determining that a pipelining parameter is satisfied. The thin mode may be associated with one or more target sizes that are less than one or more target sizes associated with a thick mode. The log writer may determine to operate the thick mode based at least in part on at least a portion of the plurality of log writer groups being unavailable to write one or more second redo log records to the online redo log.

Abstract: A composition includes an active composition. The active composition includes a niobium-titanium oxide and a silicon active material, or includes a doped niobium-titanium oxide and the silicon active material. The niobium-titanium oxide includes niobium element, titanium element and oxygen element. The doped niobium-titanium oxide includes niobium element, titanium element and oxygen element.

Abstract: A battery material is a core-shell structure, and the core-shell structure includes a core and a shell. The shell surrounds the core. A composition of the core is a silicon material. The shell includes a polymer, the polymer is linear, the polymer includes a first structure and a second structure, the first structure includes a siloxane group, and the second structure includes a carboxyl group or an ester group. The first structure is more adjacent to the core than the second structure.

Abstract: A method for manufacturing a composite material is provided, including following steps of: (1) providing a thermoplastic prepreg which includes a first fibrous layer pre-impregnated with thermoplastic resin, wherein the first fibrous layer includes at least one layer which has a thickness smaller than or equal to 0.1 min, and at least a portion of the at least one layer includes fibers of parallel; (2) providing a thermosetting prepreg which includes a second fibrous layer pre-impregnated with unsolidified thermosetting resin; (3) combining the thermoplastic prepreg with the thermosetting prepreg by thermoforming to form a non-smooth bonding interface therebetween; (4) cooling the thermoplastic prepreg and the thermosetting prepreg which are combined in the step (3) to form the composite material.

Abstract: Techniques related to failover to the secondary storage server from a primary storage server of a database server without degrading the performance of servicing storage requests for client applications are provided. In an embodiment, the secondary storage server receives, from the database server, an eviction notification indicating that a set of data blocks has been evicted from a cache. The secondary storage server's memory hierarchy includes a secondary cache and a secondary persistent storage that stores a second copy of the set of data blocks. The secondary storage server persistently stores a copy of data, which is also persistently stored on the primary storage server, which includes a first copy of the set of data blocks.

Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.

Abstract: Techniques related to failover to the secondary storage server from a primary storage server of a database server without degrading the performance of servicing storage requests for client applications are provided. In an embodiment, the secondary storage server receives, from the database server, an eviction notification indicating that a set of data blocks has been evicted from a cache. The secondary storage server's memory hierarchy includes a secondary cache and a secondary persistent storage that stores a second copy of the set of data blocks. The secondary storage server persistently stores a copy of data, which is also persistently stored on the primary storage server, which includes a first copy of the set of data blocks.

Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.

Abstract: The present invention a rotatory aerogenerator, which comprises: an axial rod; at least one first windward blade; at least one blade assembly; wherein each blade assembly component comprises: a first rod piece, a second windward blade and a second rod piece; wherein the first windward blade is pivotally connected with the first rod piece and the second rod piece for the flapping and folding activities of the second windward blade; and a supporting frame which top end is axially connected with the axial rod, so that the axial rod can rotate horizontally in the supporting frame. The rotatory aerogenerator of the present invention operates more efficiently and its upright design can be conveniently used in serial or in parallel and the user can use it in parallel by utilizing the same axial rod to achieve the effects of saving space and saving cost.

Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.

Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.

Abstract: The wind harnessing device includes an axle, a number of radially outward extending first and second poles respectively arranged at equal intervals around a first end and a second end of the axle, a number of blade assemblies, and a rack to which the axle is rotatably mounted. Each first pole is aligned with and parallel to a second pole. Each blade assembly includes a first beam, a second beam, and a flat blade. The first and second beams are respectively attached to and along a first edge and an opposite second edge of the blade. The first beam's two ends are pin joined to the outer ends of a pair of corresponding first and second poles so that the blade is able to swing about the first beam. The wind harnessing device thus structured is of lower weight, reduced cost, and easy maintenance.

Abstract: This invention discloses a high-efficiency solar cell structure which enables high throughput manufacturing process thereof. The solar cell is accomplished by forming a plurality of first emitter regions in a front surface of a substrate, a plurality of second emitter regions in the front surface, and a plurality of fingers. Each of the fingers is formed over a least a portion of the second emitter region and a portion of the first emitter region. The first emitter regions and the second emitter regions have a depth not less than 0.2 ?m.

Abstract: The present invention provides a memory device with the serial transmission interface and an error correction method for the serial transmission interface. The memory device comprises an error correction mechanism to detect or automatically correct the error earlier to make sure the correctness of the data transmission while the serial transmission interface accesses the memory. Further, the action of error corrections and data re-transmissions performed by the master device can be reduced.