Abstract: An antibody, or an antigen-binding fragment there, binding human ENO1 (GenBank: AAH506421.1) is provided. Methods for treating an ENO1 protein-related disease or disorder, inhibiting cancer invasion and diagnosis of cancer are also provided.

Abstract: A display panel has a display region and a non-display region. The display panel includes a first substrate; a second substrate disposed opposite to the first substrate; a display medium disposed between the first substrate and the second substrate; and an adhesion structure disposed between the first substrate and the second substrate and in the non-display region, wherein a width of the adhesion structure ranges from 5 ?m to 500 ?m.

Abstract: A display panel includes a first substrate; a second substrate disposed opposite to the first substrate; a display medium disposed between the first substrate and the second substrate; and a first engaging structure including a first protruding portion and a first receiving portion. The first protruding portion is disposed on a first surface of the first substrate, and the first receiving portion is disposed on a second surface of the second substrate. The first receiving portion has a first opening to expose a portion of the second surface of the second substrate. At least a portion of the first protruding portion is disposed within the first opening of the first receiving portion. The first protruding portion and the portion of the second surface of the second substrate exposed from the first opening are spaced apart by a distance.

Abstract: A semiconductor device includes a substrate, a semiconductor layer, a doped region, a device region, a first isolation structure, a second isolation structure and a terminal. The semiconductor layer is disposed over the substrate. The doped region is disposed in the semiconductor layer. The device region is disposed on the doped region and includes a source, a drain and a gate. The first isolation structure is disposed in the semiconductor layer and surrounds the doped region. The second isolation structure surrounds the first isolation structure and is spaced apart from the first isolation structure. The terminal is disposed between the first isolation structure and the second isolation structure, and is equipotential with the source.

Abstract: A manufacturing method of a fluid control device is provided. Firstly, a housing, a piezoelectric actuator and a deformable substrate are provided. The piezoelectric actuator includes a piezoelectric element and a vibration plate having a bulge. The deformable substrate includes a flexible plate and a communication plate. The flexible plate includes a movable part. Then, the flexible plate and the communication plate are stacked on and coupled with each other to form the deformable substrate. Then, the housing, the piezoelectric actuator and the deformable substrate are sequentially stacked on each other and coupled with each other. A synchronous deformation process is implemented by applying at least one external force to the deformable substrate, so that the flexible plate and the communication plate of the deformable substrate are subjected to a synchronous deformation, and a specified depth between the movable part and the bulge of the vibration plate is defined.

Abstract: An optical film with a conductive function is provided. The optical film with the conductive function includes a liquid crystal optical compensation film and a conductive layer. The conductive layer is disposed on the liquid crystal optical compensation film.

Abstract: An equipment maintenance prediction system and an operation method for the equipment maintenance prediction system are provided. The operation method includes steps of: configuring the processor to configure the factor decision module to select one of a plurality of parameter types as a decision parameter type according to a key parameter type, wherein the decision parameter type and the key parameter type are most correlative; configuring the processor to configure the prediction module to generate a prediction model according to a part of a plurality of historical sensing values of the decision parameter type and formulate a maintenance alerting condition according to a part of a plurality of historical sensing values of the key parameter type; and configuring the processor to configure the maintenance alerting module to monitor and alert according to the maintenance alerting condition.

Abstract: The present disclosure provides a semiconductor structure including a substrate, a first die over the substrate, a second die over the first die, a heat spreader having a sidewall facing toward and proximal to a sidewall of the first die, and a thermal interface material (TIM) between the sidewall of the first die and the sidewall of the heat spreader. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the TIM.

Abstract: An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.

Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

Abstract: An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.

Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

Abstract: A LED chip package structure with multifunctional integrated chips includes a substrate unit, a light-emitting unit, a chip unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The chip unit is electrically arranged on the substrate unit, and the chip unit is arranged between the light-emitting unit and a power source. The package colloid unit covers the LED chips. The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.

Abstract: An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LEDs are separated from each other by totally different spacing or partially different spacing. For example, the spacings between each two LED chips are from rarefaction to condensation, from condensation to rarefaction, from center rarefaction to outer condensation, from center condensation to outer rarefaction, alternate rarefaction and condensation, or alternate condensation and rarefaction. The package colloid unit covers the LED chips.

Abstract: An LED chip package structure with a high-efficiency heat-dissipating substrate includes a substrate unit, an adhesive body, a plurality of LED chips, package bodies and frame layers. The substrate unit has a positive substrate, a negative substrate, and a plurality of bridge substrates separated from each other and disposed between the positive and the negative substrate. The adhesive body is filled between the positive, the negative and the bridge substrates in order to connect and fix the positive substrate, the negative substrate and the bridge substrates together. The LED chips are disposed on the substrate unit and electrically connected between the positive substrate and the negative substrate. The package bodies are respectively covering the LED chips. The frame layers are respectively disposed around the packages bodies in order to form a plurality of light-projecting surfaces on the package bodies, and the light-projecting surfaces correspond to the LED chips.

Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.

Abstract: An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.

Abstract: An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.

Abstract: An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.