Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.

Abstract: Disclosed is an anti-deposition object for use in a vacuum environment with a main structure and a fluorine coating layer, the fluorine coating layer covers at least one surface of the main structure, the anti-deposition object contacts with a manufacturing process substance used or discharged during a manufacturing process performed by a manufacturing process equipment in the vacuum environment, the fluorine coating layer has a water droplet contact angle with the manufacturing process substance higher than that of the surface of the main structure, the fluorine coating layer has a hardness similar to or higher than that of the surface of the main structure, and the fluorine coating layer has a roughness lower than that of the surface of the main structure.

Abstract: Disclosed is an anti-deposition object with a main structure and a fluorine coating layer, the fluorine coating layer covers at least one surface of the main structure, the anti-deposition object contacts with a substance in an environment, the fluorine coating layer has a water droplet contact angle with the substance higher than that of the surface of the main structure, the fluorine coating layer has a hardness similar to or higher than that of the surface of the main structure, and the fluorine coating layer has a roughness lower than that of the surface of the main structure.

Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.

Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.

Abstract: A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.

Abstract: An oxygen sensing device with capability of storing energy and releasing energy including an oxygen sensing unit, a gas storing unit, and a control unit. The oxygen sensing unit includes a solid oxide electrolyte disposed between two conductive catalyst layers. The control unit includes a power source, a voltmeter, and a power output circuit. The power source provides electrical power to these conductive catalyst layers of the oxygen sensing unit to process a catalytic reaction and generate hydrocarbons for being stored in the gas storing unit. The voltmeter senses a voltage generated by the oxygen sensing unit when the oxygen sensing unit senses oxygen. The oxygen sensing unit makes the hydrocarbons stored in the gas storing unit and oxygen process a chemical reaction for generating electrical power to the power output circuit. The oxygen sensing unit uses the power source to generate hydrogen or syngas.