Patents by Inventor Shih-Chia Chiu
Shih-Chia Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096705Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.Type: ApplicationFiled: November 30, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuei-Yu Kao, Chen-Yui Yang, Hsien-Chung Huang, Chao-Cheng Chen, Shih-Yao Lin, Chih-Chung Chiu, Chih-Han Lin, Chen-Ping Chen, Ke-Chia Tseng, Ming-Ching Chang
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Publication number: 20240079787Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: ApplicationFiled: August 14, 2023Publication date: March 7, 2024Applicant: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Patent number: 11848481Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.Type: GrantFiled: April 4, 2022Date of Patent: December 19, 2023Assignee: MediaTek Inc.Inventors: Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu, Nan-Cheng Chen
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Patent number: 11796411Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.Type: GrantFiled: March 25, 2019Date of Patent: October 24, 2023Assignee: GETTOP ACOUSTIC CO., LTD.Inventors: Kuan-Hong Hsieh, Shih-Chia Chiu, Sung-Cheng Lo, Bo-Cheng You, Chun-Kai Chan, Wei-Leun Fang
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Patent number: 11764475Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: GrantFiled: August 24, 2021Date of Patent: September 19, 2023Assignee: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Publication number: 20230236222Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.Type: ApplicationFiled: March 30, 2023Publication date: July 27, 2023Applicant: MEDIATEK INC.Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
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Patent number: 11682816Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.Type: GrantFiled: July 27, 2020Date of Patent: June 20, 2023Assignee: MEDIATEK INC.Inventors: Yi-Chieh Lin, Shih-Chia Chiu
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Publication number: 20230187377Abstract: A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.Type: ApplicationFiled: November 16, 2022Publication date: June 15, 2023Applicant: MEDIATEK INC.Inventors: Tzu-Hung Lin, Chih-Ming Hung, Shih-Chia Chiu
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Publication number: 20220302574Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, a molding compound disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the molding compound. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.Type: ApplicationFiled: April 4, 2022Publication date: September 22, 2022Applicant: MediaTek Inc.Inventors: Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu, Nan-Cheng Chen
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Patent number: 11322823Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.Type: GrantFiled: September 3, 2018Date of Patent: May 3, 2022Assignee: MediaTek Inc.Inventors: Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu, Nan-Cheng Chen
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Publication number: 20220102859Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: ApplicationFiled: August 24, 2021Publication date: March 31, 2022Applicant: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Publication number: 20220034740Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.Type: ApplicationFiled: March 25, 2019Publication date: February 3, 2022Applicant: Gettop Acoustic Co.,Ltd.Inventors: Kuan-Hong HSIEH, Shih-Chia CHIU, Sung-Cheng LO, Bo-Cheng YOU, Chun-Kai CHAN, Wei-Leun FANG
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Publication number: 20210057143Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.Type: ApplicationFiled: July 27, 2020Publication date: February 25, 2021Inventors: Yi-Chieh Lin, Shih-Chia Chiu
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Patent number: 10916854Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.Type: GrantFiled: March 6, 2019Date of Patent: February 9, 2021Assignee: MEDIATEK INC.Inventors: Jiunn-Nan Hwang, Yi-Chieh Lin, Yen-Ju Lu, Shih-Chia Chiu, Wen-Chou Wu
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Publication number: 20190305428Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.Type: ApplicationFiled: March 6, 2019Publication date: October 3, 2019Inventors: Jiunn-Nan Hwang, Yi-Chieh Lin, Yen-Ju Lu, Shih-Chia Chiu, Wen-Chou Wu
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Publication number: 20190115646Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.Type: ApplicationFiled: September 3, 2018Publication date: April 18, 2019Inventors: Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu, Nan-Cheng Chen
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Patent number: 10170820Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.Type: GrantFiled: December 29, 2016Date of Patent: January 1, 2019Assignee: ASUSTeK COMPUTER INC.Inventors: Shih-Chia Chiu, Shih-Yuan Chen, Skye Hui-Hsin Wu, Chien-Hao Chiu, Wang-Ta Hsieh, Wei-Hsin Shih
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Patent number: 9991586Abstract: A portable electronic device including a front cover, a back cover and a circuit board is provided. The circuit board is located between the front cover and the back cover. The back cover is combined with the front cover and includes a back section, a plurality of side sections and a separator, at least one of the side sections adjacent to the back cover includes a groove close to the back section and a slot far away from the back section, the slot is connected through to the groove, a first antenna unit and a second antenna unit are defined at the side section by the groove and the slot. The separator is located in the groove and the slot.Type: GrantFiled: December 13, 2016Date of Patent: June 5, 2018Assignee: ASUSTeK COMPUTER INC.Inventors: Chien-Ming Hsu, Wang-Ta Hsieh, Kuei-Shun Yeh, Shih-Chia Chiu, Chuan-Chien Huang
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Publication number: 20170201006Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.Type: ApplicationFiled: December 29, 2016Publication date: July 13, 2017Inventors: Shih-Chia CHIU, Shih-Yuan CHEN, Skye Hui-Hsin WU, Chien-Hao CHIU, Wang-Ta HSIEH, Wei-Hsin SHIH
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Publication number: 20170179575Abstract: A portable electronic device including a front cover, a back cover and a circuit board is provided. The circuit board is located between the front cover and the back cover. The back cover is combined with the front cover and includes a back section, a plurality of side sections and a separator, at least one of the side sections adjacent to the back cover includes a groove close to the back section and a slot far away from the back section, the slot is connected through to the groove, a first antenna unit and a second antenna unit are defined at the side section by the groove and the slot. The separator is located in the groove and the slot.Type: ApplicationFiled: December 13, 2016Publication date: June 22, 2017Applicant: ASUSTeK COMPUTER INC.Inventors: Chien-Ming Hsu, Wang-Ta Hsieh, Kuei-Shun Yeh, Shih-Chia Chiu, Chuan-Chien Huang