Abstract: An antenna structure is electrically fixed and connected to a main board of an electronic apparatus and includes a circuit board, a high-frequency radiation layer, and a low-frequency radiation layer. The circuit board is a square body with a front surface, a back surface, a top surface, a bottom surface, and two side surfaces. The high-frequency radiation layer is arranged on the front surface of the circuit board and includes a high-frequency coupling edge thereon. The low-frequency radiation layer is arranged on the back surface of the circuit board and includes a low-frequency coupling edge thereon. Moreover, the high-frequency radiation layer and the low-frequency radiation layer fail to overlap with each other. The high-frequency coupling edge and the low-frequency coupling edge couple together to generate a bandwidth of a transmitting-and-receiving frequency of the antenna structure.

Abstract: A vertical antenna structure is electrically fixed and connected to a main board of an electronic apparatus. The vertical antenna structure includes a circuit board, an electrode layer, and a semi-hole electrode layer. The circuit board is a square body with a front surface, a back surface, a top surface, a bottom surface and two side surfaces. The electrode layer is arranged on the front surface and the back surface of the circuit board. The semi-hole electrode layer is arranged on the bottom surface of the circuit board. The semi-hole electrode layer is electrically fixed and connected to the electrode layer. Moreover, the electrode layer and the semi-hole electrode layer are electrically fixed and connected to the main board.

Abstract: An antenna structure electrically fixed on a main board of an electronic apparatus includes a high-frequency-radiation layer, a low-frequency-radiation layer, an electrode layer and a circuit board including a front surface, a back surface, and a notch. The notch allows a left pin and a right pin formed on a lower side of the circuit board. The high-frequency-radiation layer is arranged on the front surface. The low-frequency-radiation layer is arranged on the front surface or the back surface. A coupling gap is formed between the low-frequency-radiation layer and the high-frequency-radiation layer. The electrode layer is arranged on the left pin and the right pin, and electrically connected to the high-frequency-radiation layer and the low-frequency-radiation layer. The antenna structure belongs to the monopole-feed-in-coupling-loop-grounding design. When used in the main boards of different sizes, variation in grounding has a very little effect on the efficiency attenuation of the antenna structure.

Abstract: A flexible antenna structure includes a soft board, a first hard board, a soft antenna circuit and an antenna substructure. Moreover, the first hard board is arranged on the soft board. The soft antenna circuit is arranged on the soft board. The antenna substructure is arranged on the first hard board or is defined in the first hard board.

Abstract: A method of manufacturing chip antenna and a structure of the chip antenna. The method includes the following steps: preparing a substrate, drilling a plurality of rows of external through holes and internal through holes arranged longitudinally, forming fishing grooves at the predetermined distance between every two of the internal through holes arranged longitudinally, electroplating a metal material on the external through holes and the internal through holes, to form a conductive layer. Afterward, a circuit layer is formed on the conductive layer by exposure, development, and etching techniques. An ink is printed on the substrate after the circuit layer finished, and the ink cover parts of the circuit layer and parts of the substrate exposed, to form a solder mask and a recognition pattern layer. Finally, a longitudinal cutting line and a horizontal cutting line are cut on the substrate, and to form a chip antenna.

Abstract: An upright multipath antenna structure includes a base body, a first path antenna metal layer and a second path antenna metal layer. The base body includes a wiring section and a fixing section. The fixing section is connected to the wiring section. The first path antenna metal layer is arranged on the wiring section of the base body. The second path antenna metal layer is arranged on the wiring section of the base body and is electrically connected to the first path antenna metal layer. The base body includes a plurality of fixing columns. The fixing columns are arranged in the fixing section of the base body.

Abstract: A material loading device includes a loading frame and at least one first locking mechanism. The loading frame defines a receiving cavity and at least one opening communicating with the receiving cavity. Opposing inner walls of the loading frame define a plurality of first slots. The at least one first locking mechanism is disposed at the at least one opening. The at least one first locking mechanism includes a first locking portion extending downwards. The first locking portion includes a plurality of second slots and a plurality of blocks adjacent to the plurality of second slots. The first locking portion can drop by gravity, driving the plurality of blocks to move to and lock the plurality of first slots. The first locking portion can also be lifted, to drive the plurality of second slots to move to and unlock the plurality of first slots.

Abstract: An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.

Abstract: An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.

Abstract: A material loading device includes a loading frame and at least one first locking mechanism. The loading frame defines a receiving cavity and at least one opening communicating with the receiving cavity. Opposing inner walls of the loading frame define a plurality of first slots. The at least one first locking mechanism is disposed at the at least one opening. The at least one first locking mechanism includes a first locking portion extending downwards. The first locking portion includes a plurality of second slots and a plurality of blocks adjacent to the plurality of second slots. The first locking portion can drop by gravity, driving the plurality of blocks to move to and lock the plurality of first slots. The first locking portion can also be lifted, to drive the plurality of second slots to move to and unlock the plurality of first slots.

Abstract: A method of manufacturing chip antenna and a structure of the chip antenna. The method includes the following steps: preparing a substrate, drilling a plurality of rows of external through holes and internal through holes arranged longitudinally, forming fishing grooves at the predetermined distance between every two of the internal through holes arranged longitudinally, electroplating a metal material on the external through holes and the internal through holes, to form a conductive layer. Afterward, a circuit layer is formed on the conductive layer by exposure, development, and etching techniques. An ink is printed on the substrate after the circuit layer finished, and the ink cover parts of the circuit layer and parts of the substrate exposed, to form a solder mask and a recognition pattern layer. Finally, a longitudinal cutting line and a horizontal cutting line are cut on the substrate, and to form a chip antenna.

Abstract: A chip-type antenna structure includes a baseboard, a matching element, a radiation single body and a frequency-modulation element. The baseboard includes a first-ground surface, a first-clearance area and a signal-feed-in unit. A second-ground surface, a second-clearance area, a third-ground surface and a plurality of via holes through the baseboard and electrically connected to the first-ground surface and the second-ground surface are arranged on the other side of the baseboard. The matching element is electrically connected between the signal-feed-in unit and the first-ground surface. One side of the radiation single body is electrically connected to the signal-feed-in unit through the via holes. The other side of the radiation single body is electrically connected to the third-ground surface.

Abstract: A chip-type antenna structure includes a baseboard, a matching element, a radiation single body and a frequency-modulation element. The baseboard includes a first-ground surface, a first-clearance area and a signal-feed-in unit. A second-ground surface, a second-clearance area, a third-ground surface and a plurality of via holes through the baseboard and electrically connected to the first-ground surface and the second-ground surface are arranged on the other side of the baseboard. The matching element is electrically connected between the signal-feed-in unit and the first-ground surface. One side of the radiation single body is electrically connected to the signal-feed-in unit through the via holes. The other side of the radiation single body is electrically connected to the third-ground surface.

Abstract: A shoe pad assembly has a first layer, a second layer, a third layer, and an elastic base layer. The first layer is an air permeable fabric. The second layer has a gauze dipping in a solution containing activated carbon, alum, resin and ceramic powders producing far-infrared to form two web-shaped films on the gauze to become an air permeable layer. The third layer is a water absorbing polyethylene terephthalate non-woven fabric layer.

Abstract: A cushion pad has an upper layer, a middle layer, and a lower layer. The middle layer is disposed between the lower layer and the upper layer. The upper layer is made of an air-permeability fabric. The middle layer has two mixture layers, and a gauze fabric layer disposed between the mixture layers. The lower layer is made of a water-absorbing non-woven fabric.