Patents by Inventor Shih-Wei Pan

Shih-Wei Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120388
    Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Jih-Sheng Yang, Shih-Chieh Chao, Chia Ming Liang, Yih-Ann Lin, Ryan Chia-Jen Chen
  • Publication number: 20220103001
    Abstract: A flexible charging pad and a manufacturing method thereof are provided. The manufacturing method of the flexible charging pad includes: providing a double-sided tape to form an adhesion layer, one of two isolation papers is attached on the first adhesion surface, and another of the two isolation papers is attached on the second adhesion surface; removing the isolation paper attached on the first adhesion surface, and attaching a conductor on the first adhesion surface; attaching a first pad layer on the first adhesion surface to cover the conductor, the conductor is disposed between the first pad layer and the adhesion layer; disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer.
    Type: Application
    Filed: February 3, 2021
    Publication date: March 31, 2022
    Inventors: HO-LUNG LU, SHIH-WEI PAN
  • Publication number: 20070274551
    Abstract: The present invention proposes an implantable bone-vibrating hearing aid, including a transmitting coil for receiving an audio-converted signal and generating a corresponding magnetic field, a magnetic conducting element for sensing the corresponding magnetic filed to generate a driving force, and a vibrating module for receiving the driving force and generating a vibration, wherein the magnetic conducting element and the vibrating module are implanted beneath a skin of a user, and the vibration generated by the vibrating module knocks on the temporal bone of the ear of the user, which generates mechanical waves that propagate to the inner ear of the user, creating a sense of hearing thereto.
    Type: Application
    Filed: February 7, 2007
    Publication date: November 29, 2007
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Cheng-Lun Tsai, Min-Chih Chen, Shih-Wei Pan