Patents by Inventor Shijiang He

Shijiang He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket cover with heat flow for surface mount solder reflow
    Patent number: 8622278
    Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: January 7, 2014
    Assignee: Intel Corporation
    Inventors: Victor Alvarez, Scott K. Buttars, Steven R. Vandervoort, Shijiang He
  • SOCKET COVER WITH HEAT FLOW FOR SURFACE MOUNT SOLDER REFLOW
    Publication number: 20140001243
    Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Inventors: Victor Alvarez, Scott K. Buttars, Steven R. Vandervoort, Shijiang He