Patents by Inventor Shijie Song

Shijie Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250122356
    Abstract: Thermoplastic compositions include: a polymer base resin including at least one liquid crystal polymer (LCP) resin, at least one polyphenylene ether (PPE) resin, or a combination thereof; and from at least 0.1 wt % to 10 wt % of a low-OAN carbon black. The low-OAN carbon black has an oil absorption number (OAN) of 60 cubic centimeters per 100 grams (cc/100 g) or less. The compositions have good dielectric properties.
    Type: Application
    Filed: August 23, 2022
    Publication date: April 17, 2025
    Inventors: Yang Song, Shen Zhang, Shijie Song
  • Publication number: 20240352252
    Abstract: A poly(phenylene ether)-based composition exhibiting improved resistance to decomposition after repeated exposure to high voltages is prepared by melt-blending specific amounts of a poly(phenylene ether), an organophosphate ester flame retardant, and a surface energy reducing agent. The composition includes no more than 30 weight percent of mineral filler. Also described is an injection molded article prepared from the composition.
    Type: Application
    Filed: May 27, 2022
    Publication date: October 24, 2024
    Inventors: Haiming CHEN, Shijie SONG, Yapeng FANG
  • Publication number: 20240352222
    Abstract: Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 ?m to about 10 ?m, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.
    Type: Application
    Filed: August 31, 2022
    Publication date: October 24, 2024
    Inventors: Yinlong Du, Shijie Song, Yapeng Fang
  • Publication number: 20240218179
    Abstract: Disclosed herein are compositions comprising: a. from about 30 wt. % to about 60 wt. % of a polyphenylene sulfide (PPS); from greater than 20 wt. % to about 35 wt. % of a polyphenylene oxide (PPO); from about 0.01 wt. % to about 12 wt. % of a compatibilizer package, wherein the compatibilizer package comprises an ethylene-glycidyl methacrylate co-polymer, a styrene rubber copolymer, and an alicyclic saturated hydrocarbon resin present in a ratio of about 0.5:1:2 to about 3:1:4; and from about 20 wt. % to about 50 wt. % of an inorganic filler, wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition, and wherein the composition exhibits a plating adhesion of at least 5B when tested in accordance with an ASTM D3359 cross hatch adhesion test.
    Type: Application
    Filed: July 29, 2022
    Publication date: July 4, 2024
    Inventors: Shijie SONG, Jin Ju JUNG, Jong Woo LEE
  • Patent number: 11958972
    Abstract: A thermoplastic composition includes: (a) about 30 wt % to about 60 wt % of a resin component including polyphenylene ether (PPE) and polystyrene (PS); (b) from about 35 wt % to about 65 wt % of a filler component; (c) from about 1 wt % to about 5 wt % of a flow promoter including at least a partially hydrogenated hydrocarbon resin; and (d) an elastomer component including from 2.5 wt % to 5 wt % rubber content in the composition excluding the filler component. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition except as indicated in (d).
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: April 16, 2024
    Assignee: SHPP Global Technologies B.V.
    Inventors: Rui Mao, Shijie Song
  • Publication number: 20240076494
    Abstract: Disclosed herein are compositions comprising: a. from about 30 wt. % to about 70 wt. % of a polyphenylene sulfide; b. from greater than 0 wt. % to about 10 wt. % of a resin comprising polyphenylene oxide; c. from about 5 wt. % to about 15 wt. % of a laser activable metal compound; and d. from about 10 wt. % to about 70 wt. % of an inorganic filler, wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.
    Type: Application
    Filed: December 22, 2021
    Publication date: March 7, 2024
    Inventors: Shijie SONG, Yinlong DU, Yapeng FANG
  • Publication number: 20230392007
    Abstract: Thermoplastic compositions include: (a) from about 10 wt. % to 60 wt. % of a first polyphenylene oxide PPO; (b) from about 0.5 wt. % to about 10 wt. % of a second PPO with low degree of polymerization and a viscosity between 0.1 dl/g and 0.3 dl/g as measured in chloroform at 25° C. using a viscometer; (c) from about 0.5 wt. % to about 10 wt. % of a general purpose polystyrene GPPS, (d) from about 0.5 wt % to about 10 wt % of an impact modifier; and (e) from about 30 wt. % to about 70 wt. % of an inorganic ceramic filler. A ratio of the first PPO and the second PPO to polystyrene is from 1:1 to 6:1. The combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.
    Type: Application
    Filed: December 22, 2021
    Publication date: December 7, 2023
    Inventors: Shijie Song, Jian WANG, Yinlong DU
  • Publication number: 20230374301
    Abstract: A thermoplastic composition includes: (a) about 30 wt % to about 60 wt % of a resin component including polyphenylene ether (PPE) and polystyrene (PS); (b) from about 35 wt % to about 65 wt % of a filler component; (c) from about 1 wt % to about 5 wt % of a flow promoter including at least a partially hydrogenated hydrocarbon resin; and (d) an elastomer component including from 2.5 wt % to 5 wt % rubber content in the composition excluding the filler component. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition except as indicated in (d).
    Type: Application
    Filed: May 10, 2023
    Publication date: November 23, 2023
    Inventors: Rui MAO, Shijie SONG
  • Patent number: 11649357
    Abstract: A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: May 16, 2023
    Assignee: SHPP Global Technologies B.V.
    Inventors: Jian Wang, Shijie Song
  • Patent number: 11643586
    Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: May 9, 2023
    Assignee: SHPP Global Technologies B.V.
    Inventors: Jian Wang, Shijie Song, Yaqin Zhang
  • Publication number: 20220227930
    Abstract: A laser platable thermoplastic composition includes from about 38 wt % to about 90 wt % of a thermoplastic polymer, from about 0.01 wt % to about 15 wt % of a laser activatable metal compound, and from about 0.01 wt % to about 60 wt % of a magnetic filler. The magnetic filler includes a magnetic alloy. Methods for making laser platable thermoplastic compositions and articles formed therefrom—such as an induction heater for a domestic or commercial appliance—are also described.
    Type: Application
    Filed: April 24, 2020
    Publication date: July 21, 2022
    Inventors: Yapeng FANG, Shijie SONG, Jian WANG
  • Patent number: 11370911
    Abstract: Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: June 28, 2022
    Assignee: SHPP GLOBAL TECHNOLOGIES B.V.
    Inventors: Yunan Cheng, Shijie Song, Jian Wang
  • Publication number: 20220159843
    Abstract: A process of manufacturing a multilayer sheet having electrically conductive patterns comprises feeding a first polymer layer and a second polymer composition to a calendering stack, the first polymer layer having an inner electrically conductive pattern disposed thereon, the first polymer layer comprising a first polymer composition, which contains a first polymer having a first glass transition temperature, and the second polymer composition comprising a second polymer and a laser direct structure additive (LDS), the second polymer having a second glass transition temperature that is 50 to 100° C.
    Type: Application
    Filed: March 24, 2020
    Publication date: May 19, 2022
    Inventors: Shijie SONG, Yuan ZHOU, Zhe CHEN
  • Patent number: 11104796
    Abstract: A polycarbonate composition contains, based on the total weight of the polycarbonate composition: one or more polycarbonate homopolymers; a poly(carbonate-siloxane) copolymer comprising siloxane units with an average block length of 5 to 120, preferably 10 to 100, the poly(carbonate-siloxane) copolymer being present in an amount effective to provide 2.5 to 10 wt % of siloxane units based on the total weight of the polycarbonate composition; 1 to 8 wt % of an elastomer-modified graft copolymer; 0.01 to 5 wt % of a silicone oil; and 0.1 to 8 wt % of an additive; and wherein the composition has a melt mass flow rate higher than 16 g/10 min, determined in accordance with ASTM D1238 under a load of 1.2 kg at 300° C. with a dwelling time of 300 seconds; and an Izod notched impact energy of at least 700 J/m measured at 23° C. on a sample of 3.2 mm thickness according to ASTM D256-10.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 31, 2021
    Assignee: SHPP GLOBAL TECHNOLOGIES B.V.
    Inventors: Yagang Chen, Wei Shan, Shijie Song, Yaming Niu
  • Patent number: 11028250
    Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: June 8, 2021
    Assignee: SHPP Global Technologies B.V.
    Inventors: Yaqin Zhang, Jian Wang, Mingcheng Guo, Yunan Cheng, Shijie Song
  • Publication number: 20210130585
    Abstract: Disclosed herein are compositions thermoplastic composition comprising: (a) about 20 wt % to about 99 wt % of a polymer component; and (b) about 1 wt % to about 30 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component comprising copper hydroxide phosphate or tin and antimony oxide, said core comprising from about 10 wt % to about 80 wt % of the laser activatable additive and said shell comprising from about 20 wt % to about 90 wt % of the laser activatable additive.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 6, 2021
    Inventors: Jian WANG, Yunan Cheng, Yaqin ZHANG, Shijie SONG
  • Patent number: 10921356
    Abstract: This disclosure relates to optical RF spectrum analysers and methods for analysing an input RF signal. An optical modulator modulates an input RF signal onto a carrier frequency and an optical spectral weight with a spectral weight function modifies the modulated optical signal. The spectral weight defines a frequency relationship between the spectral weight function and the carrier frequency. A frequency control module modifies the frequency relationship between the spectral weight function and the carrier frequency over time. An optical sensor senses the modified optical signal over time and to generates an RF signal over time. A signal recovery module calculates the RF spectrum based on the RF signal over time. Shifting the spectral weight against the carrier frequency over time results in a high spectral resolution even if the spectral weight is relatively broad band. The result is an increased spectral resolution at a reduced price/complexity and increased robustness.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: February 16, 2021
    Assignee: The University of Sydney
    Inventors: Shijie Song, Xiaoke Yi
  • Publication number: 20210024701
    Abstract: A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.
    Type: Application
    Filed: March 18, 2019
    Publication date: January 28, 2021
    Inventors: Jian WANG, Shijie SONG
  • Publication number: 20210009886
    Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.
    Type: Application
    Filed: March 26, 2019
    Publication date: January 14, 2021
    Inventors: Jian WANG, Shijie SONG, Yaqin ZHANG
  • Patent number: D1072863
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: April 29, 2025
    Assignee: FUTU NETWORK TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Zhen Liu, Hongyan Xie, Minyi Lu, Jiahui Liu, Shijie Song