Abstract: Embodiments of the present invention provide a press tool and an electronic product detecting apparatus including the press tool. The press tool includes: a connector soft-contact member including: a first base plate; a floating plate mounted to the first base plate; and a buffer member mounted between the first base plate and the floating plate and configured such that when receiving a pressing force, the buffer member generates a repulsive force, so that the floating plate is floatable; and a press member connected with the connector soft-contact member such that they are openable and closable relative to each other. The press member includes a second base plate and a connector bearing piece which is mounted to the second base plate and which is positioned just opposite to the floating plate when the connector soft-contact member and the press member are closed.

Abstract: The present invention relates to a coating formulation comprising at least one carbonaceous material and a coating material. The present invention also relates to a method for preparing a coating formulation comprising at least one carbonaceous material and a coating material comprising the step of dispersing the at least one carbonaceous material in the coating material.

Abstract: The present disclosure describes a multilayer coating, comprising at least one metal oxide layer; and a composite layer provided on said metal oxide layer, said composite layer comprising at least one metal layer disposed between at least two barrier layers, and wherein said barrier layers are substantially impermeable to oxygen. The multilayer coating may be useful as transparent heat reflectors on glass, plastic, and on low temperature processing transparent substrate for energy saving application.

Abstract: A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.

Abstract: An apparatus for the recovery of gold from a gold-bearing aqueous filtrate, the process comprising the steps of: (A) Contacting the aqueous filtrate with dibutyl carbitol (DBC) in a two-stage solvent extraction process to remove the gold from the aqueous filtrate into the DBC to form a gold-loaded DBC; and (D) Contacting the gold-loaded DBC with an aqueous acid scrub of hydrochloric acid in a four-stage countercurrent scrub process to remove impurities, e.g., non-gold metal, from the DBC into the aqueous scrub solution to form an impurity-loaded aqueous scrub. Each stage of the solvent extraction circuit and the aqueous acid scrub circuit is equipped with a mixing assembly and a phase separation tank in a head-tail arrangement such that the mixing assembly of one stage is adjacent to the phase separation tank of the adjacent stage.

Abstract: Devices and methods for forming a device are disclosed. The method includes providing a substrate having first and second surfaces. At least one through silicon via (TSV) opening is formed in the substrate. The TSV opening extends through the first and second surfaces of the substrate. An alignment trench corresponding to an alignment mark is formed in the substrate. The alignment trench extends from the first surface of the substrate to a depth shallower than a depth of the TSV opening. A dielectric liner layer is provided over the substrate. The dielectric liner layer at least lines sidewalls of the TSV opening. A conductive layer is provided over the substrate. The conductive layer fills at least the TSV opening to form TSV contact. A redistribution layer (RDL) is formed over the substrate. The RDL layer is patterned using a reticle to form at least one opening which corresponds to a TSV contact pad. The reticle is aligned using the alignment mark in the substrate.

Abstract: An apparatus for the recovery of gold from a gold-bearing aqueous filtrate, the process comprising the steps of: (A) Contacting the aqueous filtrate with dibutyl carbitol (DBC) in a two-stage solvent extraction process to remove the gold from the aqueous filtrate into the DBC to form a gold-loaded DBC; and (D) Contacting the gold-loaded DBC with an aqueous acid scrub of hydrochloric acid in a four-stage countercurrent scrub process to remove impurities, e.g., non-gold metal, from the DBC into the aqueous scrub solution to form an impurity-loaded aqueous scrub. Each stage of the solvent extraction circuit and the aqueous acid scrub circuit is equipped with a mixing assembly and a phase separation tank in a head-tail arrangement such that the mixing assembly of one stage is adjacent to the phase separation tank of the adjacent stage.

Abstract: Devices and methods for forming a device are disclosed. The method includes providing a substrate having first and second surfaces. At least one through silicon via (TSV) opening is formed in the substrate. The TSV opening extends through the first and second surfaces of the substrate. An alignment trench corresponding to an alignment mark is formed in the substrate. The alignment trench extends from the first surface of the substrate to a depth shallower than a depth of the TSV opening. A dielectric liner layer is provided over the substrate. The dielectric liner layer at least lines sidewalls of the TSV opening. A conductive layer is provided over the substrate. The conductive layer fills at least the TSV opening to form TSV contact. A redistribution layer (RDL) is formed over the substrate. The RDL layer is patterned using a reticle to form at least one opening which corresponds to a TSV contact pad. The reticle is aligned using the alignment mark in the substrate.

Abstract: There is provided a multilayer coating comprising a plurality of layers comprising a) one or more layers of an elemental transition metal; b) one or more layers of an elemental metalloid; and c) two or more layers of an oxide; characterized in that the transition metal and metalloid layers are between the oxide layers and the plurality of layers does not need to contain an additional transparent conductive film (TCF). The multilayer coatings show high transparency in the visible light range combined with heat shielding without the need of transparent conductive oxide which have been previously used to achieve these properties. The multilayers can be produced with conventional physical vapor deposition methods on glass and polymer substrates. The coatings may therefore be used for applications on windows, plastic sheets and window shields. The invention relates also to the process for making the multilayer coatings, articles comprising them and their use in building and other applications.

Abstract: The instant invention provides a process for making metal or metalloid dichalcogenides from a metal or metalloid and elemental chalcogen using magnetron sputtering. The process may comprise the steps of directing sputtering gas ions at a metal or metalloid target, reacting the ejected metal or metalloid atoms from the target surface with an elemental chalcogen vapor and assembling the metal or metalloid dichalcogenides on a substrate. It can be used to make thin films of the dichalcogenides which have a use in layered semiconductor devices. The process of the invention is suitable for upscaling to potentially make the films on a wafer level. Films on large areas with high uniformity have for instance been obtained utilizing the reaction of the metal or metalloid in an ambient of vaporized chalcogen under controlled conditions and with low growth rates. The process of the invention can be used to deposit two dimensional channels as part of field effect transistors.

Abstract: A composite glue coating device and a preparation method for a fancy reflective material using the same, which relates to the technical field of reflective material production. The composite glue coating device comprises a composite glue roller (1), a glue coating roller (2), a glue sink device (3) and a glue scrapping device (4). The composite glue roller (1) and the glue coating roller (2) are arranged as a clamping roller set and a bead planting film passing interval (L) is formed between the composite glue roller (1) and the glue coating roller (2). The glue scrapping device (4) is connected with a scraper of the glue coating roller (2). A plurality of glue moving grooves (5) are evenly distributed on the glue coating roller (2). The glue coating roller (2) is connected with the glue sink device (3) and is glue immersed.

Abstract: A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.

Abstract: Integrated circuits and methods for manufacturing the same are provided. An integrated circuit includes a base dielectric layer, a first dielectric layer overlying the base dielectric layer, and a second dielectric layer overlying the first dielectric layer. A first overlay mark is positioned within the first dielectric layer, and a second overlay mark is positioned within the second dielectric layer, where the second overlay mark is offset from the first overlay mark. First and second blocks are positioned within the base dielectric layer, where the first overlay mark directly overlays the first block and the second overlay mark directly overlays the second block.

Abstract: Integrated circuits and methods for manufacturing the same are provided. An integrated circuit includes a base dielectric layer, a first dielectric layer overlying the base dielectric layer, and a second dielectric layer overlying the first dielectric layer. A first overlay mark is positioned within the first dielectric layer, and a second overlay mark is positioned within the second dielectric layer, where the second overlay mark is offset from the first overlay mark. First and second blocks are positioned within the base dielectric layer, where the first overlay mark directly overlays the first block and the second overlay mark directly overlays the second block.

Abstract: There is provided a method for treating a substance having a thermal barrier coating in contact with an alloy substrate comprising the step of irradiating the thermal barrier coating while the alloy substrate is maintained at a substantially constant temperature. There is also provided a system for treating a substance having a thermal barrier coating in contact with an alloy substrate. There is also provided a substance having an alloy substrate in contact with a radiation treated thermal barrier coating.

Abstract: Devices and methods for forming a device are disclosed. The method includes providing a substrate having first and second surfaces. At least one through silicon via (TSV) opening is formed in the substrate. The TSV opening extends through the first and second surfaces of the substrate. An alignment trench corresponding to an alignment mark is formed in the substrate. The alignment trench extends from the first surface of the substrate to a depth shallower than a depth of the TSV opening. A dielectric liner layer is provided over the substrate. The dielectric liner layer at least lines sidewalls of the TSV opening. A conductive layer is provided over the substrate. The conductive layer fills at least the TSV opening to form TSV contact. A redistribution layer (RDL) is formed over the substrate. The RDL layer is patterned using a reticle to form at least one opening which corresponds to a TSV contact pad. The reticle is aligned using the alignment mark in the substrate.

Abstract: There is provided a multilayer coating comprising a plurality of layers comprising a) one or more layers of an elemental transition metal; b) one or more layers of an elemental metalloid; and c) two or more layers of an oxide; characterized in that the transition metal and metalloid layers are between the oxide layers and the plurality of layers does not need to contain an additional transparent conductive film (TCF). The multilayer coatings show high transparency in the visible light range combined with heat shielding without the need of transparent conductive oxide which have been previously used to achieve these properties. The multilayers can be produced with conventional physical vapour deposition methods on glass and polymer substrates. The coatings may therefore be used for applications on windows, plastic sheets and window shields. The invention relates also to the process for making the multilayer coatings, articles comprising them and their use in building and other applications.

Abstract: A phase separation tank for separating an aqueous liquid from an organic liquid, the tank comprising: (A) A separation compartment having a sloped bottom wall and an aqueous liquid outlet; (B) An organic liquid compartment separated from the separation compartment by an organic separator of a height that allows for the overflow of organic liquid from the separation compartment to the organic compartment; (C) An aqueous liquid compartment separated from the organic liquid compartment by an aqueous separator and separated from the separation compartment by the organic compartment, the aqueous liquid compartment equipped with an aqueous liquid inlet; and (D) Means for transferring aqueous liquid from the aqueous liquid outlet of the separation compartment to the aqueous liquid inlet of the aqueous compartment.

Abstract: A process for the recovery of gold from a gold-bearing aqueous filtrate, the process comprising the steps of: (A) Contacting the aqueous filtrate with dibutyl carbitol (DBC) in a two-stage solvent extraction process to remove the gold from the aqueous filtrate into the DBC to form a gold-loaded DBC; and (D) Contacting the gold-loaded DBC with an aqueous acid scrub of hydrochloric acid in a four-stage countercurrent scrub process to remove impurities, e.g., non-gold metal, from the DBC into the aqueous scrub solution to form an impurity-loaded aqueous scrub. Each stage of the solvent extraction circuit and the aqueous acid scrub circuit is equipped with a mixing assembly and a phase separation tank in a head-tail arrangement such that the mixing assembly of one stage is adjacent to the phase separation tank of the adjacent stage.

Abstract: A process for the recovery of gold from a gold-bearing aqueous filtrate, the process comprising the steps of: (A) Contacting the aqueous filtrate with dibutyl carbitol (DBC) in a two-stage solvent extraction process to remove the gold from the aqueous filtrate into the DBC to form a gold-loaded DBC; and (D) Contacting the gold-loaded DBC with an aqueous acid scrub of hydrochloric acid in a four-stage countercurrent scrub process to remove impurities, e.g., non-gold metal, from the DBC into the aqueous scrub solution to form an impurity-loaded aqueous scrub. Each stage of the solvent extraction circuit and the aqueous acid scrub circuit is equipped with a mixing assembly and a phase separation tank in a head-tail arrangement such that the mixing assembly of one stage is adjacent to the phase separation tank of the adjacent stage.