Abstract: Methods, apparatuses and systems in an integrated bonding system for optimizing bonding alignment between dies and a substrates include bonding, using a bonder of the integrated bonding system, a first die to a first substrate using preset alignment settings, transferring, using a transfer arm/robot of the integrated bonding system, the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system, inspecting, at the on-board inspection tool, an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination, determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder, and bonding, in the bonder, a different die to a different substrate using the determined machine-learning based correction measurement.

Abstract: The subject matter of this specification can be implemented in, among other things, a method, system, and/or device to receive current metrology data for an operation on a current sample in a fabrication process. The metrology data includes a current value for a parameter at each of one or more locations on the current sample. The method further includes determining a current rate of change of the parameter value for each of the one or more locations. The current rate of change is associated with the current sample. The method further includes identifying one or more violating locations each having an associated current rate of change of the parameter value that is greater than an associated reference rate of change of the parameter value, and identifying an instance of abnormality of the fabrication process based on the one or more violating locations.

Abstract: The subject matter of this specification can be implemented in, among other things, a method, system, and/or device to receive current metrology data for an operation on a current sample in a fabrication process. The metrology data includes a current value for a parameter at each of one or more locations on the current sample. The method includes obtaining a reference rate of change of the parameter value of the parameter for each of the one or more locations. The method further includes determining a current rate of change of the parameter value for each of the one or more locations. The current rate of change is associated with the current sample. The method further includes comparing the current rate of change of the parameter value to the reference rate of change of the parameter value and identifying an instance of abnormality of the fabrication process based on the comparison.

Abstract: The subject matter of this specification can be implemented in, among other things, a method, system, and/or device to receive current metrology data for an operation on a current sample in a fabrication process. The metrology data includes a current value for a parameter at each of one or more locations on the current sample. The method includes obtaining a reference rate of change of the parameter value of the parameter for each of the one or more locations. The method further includes determining a current rate of change of the parameter value for each of the one or more locations. The current rate of change is associated with the current sample. The method further includes comparing the current rate of change of the parameter value to the reference rate of change of the parameter value and identifying an instance of abnormality of the fabrication process based on the comparison.