Abstract: A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. A DC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.

Abstract: A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. ADC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.

Abstract: A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate. The adhesive layer is disposed on the bottom wall of each pocket in the plurality of pockets, such that when a component is placed in a pocket in the plurality of pockets, the adhesive layer in the pocket permanently bonds to the component, and such that when the adhesive is exposed to UV radiation the adhesive bond strength is sufficiently reduced so that the component can be removed from the pocket.

Abstract: A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate. The adhesive layer is disposed on the bottom wall of each pocket in the plurality of pockets, such that when a component is placed in a pocket in the plurality of pockets, the adhesive layer in the pocket permanently bonds to the component, and such that when the adhesive is exposed to UV radiation the adhesive bond strength is sufficiently reduced so that the component can be removed from the pocket.

Abstract: A cover film for heat-sealing to a carrier tape for carrying electronic components is described herein. The cover film comprises a polyester base layer, a first antistatic layer disposed on a first surface of the base layer, an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, the first intermediate layer disposed on a second surface of the base layer opposite the first antistatic layer, the second intermediate layer disposed on the first intermediate layer opposite the base layer, a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer, and a heat-sealing layer disposed on the second antistatic layer. In an exemplary aspect, the first intermediate layer comprises polyethylene and the second intermediate layer comprises a poly(vinyl acetate) copolymer and a polystyrene-butadiene) copolymer. In another exemplary aspect, the second antistatic layer comprises carbon nanotubes in a polyacrylate binder.

Abstract: The present invention discloses a method and apparatus for longest prefix matching.