Patents by Inventor Shijun Shen

Shijun Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12112001
    Abstract: In one embodiment, a method includes receiving touch inputs from a user corresponding to an activation trigger for an assistant system executing on a head-mounted device at the head-mounted device, accessing signals from inertial measurement unit (IMU) sensors of the head-mounted device by the head-mounted device, determining that the user is either donning or doffing the head-mounted device by an on-device don/doff detection model and based only on the signals from the IMU sensors, and overriding the activation trigger to prevent an activation of the assistant system responsive to the received touch inputs.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: October 8, 2024
    Assignee: Meta Platforms, Inc.
    Inventors: Rongzhou Shen, Amy Lawson Bearman, Shijun Sun, Qian Fang, Riza Kazemi
  • Publication number: 20240310957
    Abstract: In one embodiment, a method includes receiving touch inputs from a user corresponding to an activation trigger for an assistant system executing on a head-mounted device at the head-mounted device, accessing signals from inertial measurement unit (IMU) sensors of the head-mounted device by the head-mounted device, determining that the user is either donning or doffing the head-mounted device by an on-device don/doff detection model and based only on the signals from the IMU sensors, and overriding the activation trigger to prevent an activation of the assistant system responsive to the received touch inputs.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 19, 2024
    Inventors: Rongzhou Shen, Amy Lawson Bearman, SHIJUN SUN, Qian Fang, Riza Kazemi
  • Patent number: 11700025
    Abstract: A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. A DC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: July 11, 2023
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Xiaoning Li, Wei Zhou, Zidong Zhang, Xin Fang, Shijun Shen, Dawei Gong, Dejie Li
  • Publication number: 20220385323
    Abstract: A wireless single-phase AC-to-AC conversion circuit based on a 2.4G microwave includes a receiving antenna unit, a RF switch unit, a positive voltage rectification unit, a negative voltage rectification unit and an AC synthesis unit. An output port of the receiving antenna unit is connected to the common input port of the RF switch unit. A first microwave output end of the RF switch unit and a second microwave output end of the RF switch unit are correspondingly connected to a microwave input end of the positive voltage rectification unit and a microwave input end of the negative voltage rectification unit, respectively. ADC output end of the positive voltage rectification unit and a DC output end of the negative voltage rectification unit are correspondingly connected to a positive voltage input port of the AC synthesis unit and a negative voltage input port of the AC synthesis unit, respectively.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 1, 2022
    Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Xiaoning LI, Wei ZHOU, Zidong ZHANG, Xin FANG, Shijun SHEN, Dawei GONG, Dejie LI
  • Publication number: 20170162418
    Abstract: A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate. The adhesive layer is disposed on the bottom wall of each pocket in the plurality of pockets, such that when a component is placed in a pocket in the plurality of pockets, the adhesive layer in the pocket permanently bonds to the component, and such that when the adhesive is exposed to UV radiation the adhesive bond strength is sufficiently reduced so that the component can be removed from the pocket.
    Type: Application
    Filed: February 20, 2017
    Publication date: June 8, 2017
    Inventors: Bing Huang, Chu Ouyang, Wei Xiang Zhang, Shijun Shen, Hengyuan Zhou, Yan Jin, Xuzhi Cheng
  • Publication number: 20150158649
    Abstract: A carrier tape for transporting a plurality of components includes a flexible substrate extending along a longitudinal axis of the carrier tape, a plurality of pockets formed in the substrate and spaced apart along the longitudinal axis of the carrier tape, and an adhesive layer. Each pocket includes a bottom wall and a side wall extending from the bottom wall to a top surface of the flexible substrate. The adhesive layer is disposed on the bottom wall of each pocket in the plurality of pockets, such that when a component is placed in a pocket in the plurality of pockets, the adhesive layer in the pocket permanently bonds to the component, and such that when the adhesive is exposed to UV radiation the adhesive bond strength is sufficiently reduced so that the component can be removed from the pocket.
    Type: Application
    Filed: July 20, 2012
    Publication date: June 11, 2015
    Applicant: 3M Innovative Properties Company
    Inventors: Bing Huang, Chu Ouyang, Wei Xiang Zhang, Shijun Shen, Hengyuan Zhou, Yan Jin, Xuzhi Cheng
  • Publication number: 20140170414
    Abstract: A cover film for heat-sealing to a carrier tape for carrying electronic components is described herein. The cover film comprises a polyester base layer, a first antistatic layer disposed on a first surface of the base layer, an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, the first intermediate layer disposed on a second surface of the base layer opposite the first antistatic layer, the second intermediate layer disposed on the first intermediate layer opposite the base layer, a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer, and a heat-sealing layer disposed on the second antistatic layer. In an exemplary aspect, the first intermediate layer comprises polyethylene and the second intermediate layer comprises a poly(vinyl acetate) copolymer and a polystyrene-butadiene) copolymer. In another exemplary aspect, the second antistatic layer comprises carbon nanotubes in a polyacrylate binder.
    Type: Application
    Filed: September 1, 2011
    Publication date: June 19, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Wei Xiang Zhang, Shijun Shen, Bing Huang
  • Patent number: 7539153
    Abstract: The present invention discloses a method and apparatus for longest prefix matching.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: May 26, 2009
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jun Liang, Shijun Shen, Meng Li, Juan Zhang, Rui Hu, Jun Gong