Patents by Inventor Shike Sou

Shike Sou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive material, connection structure and method for producing connection structure
    Patent number: 11101052
    Abstract: There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: August 24, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hidefumi Yasui, Shuujirou Sadanaga, Masahiro Itou, Shike Sou, Yuta Yamanaka
  • CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
    Publication number: 20190252089
    Abstract: There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.
    Type: Application
    Filed: September 21, 2017
    Publication date: August 15, 2019
    Inventors: Sayaka Wakioka, Hidefumi Yasui, Shuujirou Sadanaga, Masahiro Itou, Shike Sou, Yuta Yamanaka
  • CONDUCTIVE MATERIAL, CONNECTION STRUCTURE BODY, AND CONNECTION STRUCTURE BODY PRODUCTION METHOD
    Publication number: 20190206587
    Abstract: The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.
    Type: Application
    Filed: August 30, 2017
    Publication date: July 4, 2019
    Inventors: Shike Sou, Masahiro Itou, Shuujirou Sadanaga