Patents by Inventor Shila Alavi

Shila Alavi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250140896
    Abstract: A stackable solid-state battery cell, a packaged solid-state battery including the same, and a method of making the same are disclosed. The battery cell includes a substrate, a cathode on or over the substrate, a solid-state electrolyte on the cathode, an anode current collector (ACC) on the solid-state electrolyte, an insulator layer on the ACC having a sidewall portion, a conductive redistribution layer on the insulator layer, including the sidewall portion, in electrical contact with the ACC, and a printed adhesive on a major surface of the cell. The packaged solid-state battery includes a plurality of the stackable solid-state battery cells and battery terminals in electrical contact with an active layer of each cell. The method includes printing the adhesive on the major surface, which can be the outermost surface of the redistribution layer and the insulator layer, or the substrate surface opposite from the cathode.
    Type: Application
    Filed: October 24, 2024
    Publication date: May 1, 2025
    Applicant: Ensurge Micropower ASA
    Inventors: Arvind KAMATH, Shila ALAVI, Khanh TRAN, Mihalis MICHAEL, Yasumasa MORITA
  • Publication number: 20250140916
    Abstract: A solid-state battery cell and a method of making the same are disclosed. The battery cell includes a substrate, a cathode on or over the substrate, a solid-state electrolyte on the cathode, an anode current collector (ACC) on the solid-state electrolyte, a conductive bump on the ACC, an insulator layer on the ACC and having a sidewall portion, and a conductive redistribution layer in ohmic contact with the conductive bump and on the insulator layer, including the sidewall portion. The insulator layer surrounds the conductive bump and exposes a surface of the conductive bump. The method includes printing the conductive bump on the ACC, printing the insulator layer on the ACC and a sidewall of the ACC, solid-state electrolyte, cathode and substrate, and forming the conductive redistribution layer on the exposed conductive bump and the insulator layer, including the sidewall portion.
    Type: Application
    Filed: October 24, 2024
    Publication date: May 1, 2025
    Applicant: Ensurge Micropower ASA
    Inventors: Arvind KAMATH, Shila ALAVI, Khanh TRAN, Mihalis MICHAEL, Yasumasa MORITA
  • Patent number: D754597
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: April 26, 2016
    Assignee: SOLICULTURE, INC.
    Inventors: Melissa Osborn, Shila Alavi
  • Patent number: D877059
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 3, 2020
    Assignee: Soliculture, Inc.
    Inventors: Melissa Osborn, Shila Alavi
  • Patent number: D914590
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 30, 2021
    Assignee: Soliculture, Inc.
    Inventors: Melissa Osborn, Shila Alavi