Abstract: Disclosed in the present invention is a terahertz kinetic inductance bolometer, including a superconducting thin film layer, a terahertz antenna, a cutoff layer and a Si substrate, wherein the superconducting thin film layer and the terahertz antenna are respectively deposited on the cutoff layer, and the cutoff layer is deposited on the Si substrate; the superconducting thin film layer includes a superconducting feeder line, an inter-digital capacitor and an inductor coil; the inter-digital capacitor is connected with the inductor coil in parallel to form an oscillation circuit; the terahertz antenna is adjacent to the inductor coil and is used to convert a received terahertz signal into heat so that the inductor coil produces an inductance change; a resonance frequency in the inter-digital capacitor changes through the inductance change; and the superconducting feeder line receives the varying resonance frequency, through which an light intensity of the terahertz signal can be obtained to complete the detec

Abstract: Disclosed in the present invention is a terahertz kinetic inductance bolometer, including a superconducting thin film layer, a terahertz antenna, a cutoff layer and a Si substrate, wherein the superconducting thin film layer and the terahertz antenna are respectively deposited on the cutoff layer, and the cutoff layer is deposited on the Si substrate; the superconducting thin film layer includes a superconducting feeder line, an inter-digital capacitor and an inductor coil; the inter-digital capacitor is connected with the inductor coil in parallel to form an oscillation circuit; the terahertz antenna is adjacent to the inductor coil and is used to convert a received terahertz signal into heat so that the inductor coil produces an inductance change; a resonance frequency in the inter-digital capacitor changes through the inductance change; and the superconducting feeder line receives the varying resonance frequency, through which an light intensity of the terahertz signal can be obtained to complete the detec

Abstract: The present invention discloses the low-stress niobium nitride (NbN) superconducting thin film and preparation method and application thereof. The preparation method includes the following steps: providing the metal Nb target and the Si-based substrates, fixing the Si-based substrate at room temperature, adjusting the mass flow ratio of N2/Ar to 20%-50%, the sputtering power to 50-400 W and the deposition pressure to 3.0-10.0 mTorr, NbN superconducting thin films with a stress range of-500 MPa˜500 MPa and a thickness of 70-150 nm were deposited on Si-based substrates. By synergistically controlling the mass flow rate ratio of N2/Ar, sputtering power, and deposition pressure, low stress NbN superconducting thin films can be easily and efficiently prepared. The stress range of the prepared NbN superconducting thin films meets the preparation requirements of superconducting dynamic inductance detectors, and can be mass-produced.