Patents by Inventor Shimada Junji

Shimada Junji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Styrene polymer, chemically amplified positive resist composition and patterning process
    Patent number: 6613844
    Abstract: A chemically amplified positive resist composition comprising a styrene polymer represented by formula (1), terminated with P, and having a weight average molecular wherein R is OH or OR3, R1 is H or CH3, R2 is alkyl, R3 is acid labile group, x≧0, y>0, k≧0, m≧0, n>0, 0<q≦0.8, p+q=1, P is H, alkyl, alkenyl, aromatic, carboxyl, OH, —R4(COR5)r, —R4O(OH)r or —R4 (OR5)r. A chemically amplified positive resist composition comprising the polymer as a base resin has high sensitivity and resolution and forms resist patterns having plasma etching resistance, heat resistance, and reproducibility.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: September 2, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Osamu Watanabe, Shimada Junji, Nagura Shigehiro, Takeda Takanobu
  • Novel styrene polymer, chemically amplified positive resist composition and patterning process
    Publication number: 20030013832
    Abstract: A styrene polymer represented by formula (1), terminated with P, and having a weight average molecular 1
    Type: Application
    Filed: March 19, 2002
    Publication date: January 16, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Osamu Watanabe, Shimada Junji, Nagura Shigehiro, Takeda Takanobu
  • Styrene polymer, chemically amplified positive resist composition and patterning process
    Patent number: 6384169
    Abstract: A styrene polymer represented by formula (1), terminated with P, and having a weight average molecular wherein R is OH or OR3 R1 is H or CH3, R2 is alkyl, R3 is acid labile group, x≧0, y>0, k≧0, m≧0, n>0, 0<q≦0.8, p+q=1, P is H, alkyl, alkenyl, aromatic, carboxyl, OH, —R4 (COR5)r, —R4O (OH)r or —R4 (OR5)r. A chemically amplified positive resist composition comprising the polymer as a base resin has high sensitivity and resolution and forms resist patterns having plasma etching resistance, heat resistance, and reproducibility.
    Type: Grant
    Filed: October 7, 1998
    Date of Patent: May 7, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Osamu Watanabe, Shimada Junji, Nagura Shigehiro, Takeda Takanobu