Patents by Inventor Shimazaki Yo

Shimazaki Yo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
    Patent number: 8420446
    Abstract: A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 ?m or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: April 16, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shimazaki Yo, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa