Abstract: A device for harvesting motion energy, the device including an outer structure, a plurality of piezoelectric units including a permanent source of electromagnetic field (magnet or electret) attached to a piezoelectric material, where each of the piezoelectric units is fixed, at least in part, to the outer structure, an inner structure located inside the outer structure, the inner structure including a plurality of permanent sources of electromagnetic field (magnets or electrets) fixed to a rigid frame, the inner structure is configured to be suspended within the outer structure due to mutual electromagnetic forces acting between permanent sources of electromagnetic field pertaining to the piezoelectric units and permanent sources of electromagnetic field pertaining to the inner structure, and an electric circuit configured to store or provide electric energy supplied by the piezoelectric units due to strain caused by relative motion between the outer structure and the inner structure.

Abstract: A device for harvesting motion energy, the device having an outer structure, multiple piezoelectric units having a permanent source of electromagnetic field (magnet or electret) attached to a piezoelectric material, where each of the piezoelectric units is fixed, at least in part, to the outer structure, where the inner structure is configured to be free to move within the outer structure, and an electric circuit configured to store or provide electric energy supplied by the piezoelectric units due to strain caused by relative motion between the outer structure and the inner structure.

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

Abstract: Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.

Abstract: Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.