Patents by Inventor SHIMPEI OBATA

SHIMPEI OBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11647583
    Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: May 9, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shimpei Obata, Ryuuji Takahashi, Yasunori Hoshino, Shigetoshi Fujita
  • Patent number: 11414528
    Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 16, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryuji Takahashi, Shimpei Obata, Yasunori Ambe, Tomo Muguruma
  • Publication number: 20220025171
    Abstract: A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.
    Type: Application
    Filed: November 15, 2019
    Publication date: January 27, 2022
    Inventors: Tomo MUGURUMA, Ryuji TAKAHASHI, Shimpei OBATA, Yasunori AMBE
  • Publication number: 20200332078
    Abstract: A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.
    Type: Application
    Filed: October 12, 2018
    Publication date: October 22, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryuji TAKAHASHI, Shimpei OBATA, Yasunori AMBE, Tomo MUGURUMA
  • Patent number: 10472478
    Abstract: A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: November 12, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yasunori Hoshino, Shimpei Obata, Shigetoshi Fujita, Ryuji Takahashi
  • Publication number: 20190181081
    Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 ?m and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.
    Type: Application
    Filed: February 14, 2019
    Publication date: June 13, 2019
    Inventors: Hiroki TAMIYA, Koji KISHINO, Ryuji TAKAHASHI, Yasunori HOSHINO, Takahiro YAMADA, Shimpei OBATA, Hiroyuki SHIRAKI, Shinya ARAKAWA, Shigetoshi FUJITA
  • Publication number: 20190150279
    Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.
    Type: Application
    Filed: April 18, 2017
    Publication date: May 16, 2019
    Inventors: Shimpei OBATA, Ryuuji TAKAHASHI, Yasunori HOSHINO, Shigetoshi FUJITA
  • Publication number: 20180327559
    Abstract: A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.
    Type: Application
    Filed: September 5, 2016
    Publication date: November 15, 2018
    Inventors: YASUNORI HOSHINO, SHIMPEI OBATA, SHIGETOSHI FUJITA, RYUJI TAKAHASHI
  • Publication number: 20160293538
    Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 ?m and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.
    Type: Application
    Filed: March 15, 2016
    Publication date: October 6, 2016
    Inventors: HIROKI TAMIYA, KOJI KISHINO, RYUJI TAKAHASHI, YASUNORI HOSHINO, TAKAHIRO YAMADA, SHIMPEI OBATA, HIROYUKI SHIRAKI, SHINYA ARAKAWA, SHIGETOSHI FUJITA