Patents by Inventor Shimpei Sasaoka
Shimpei Sasaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180254394Abstract: A light emitting apparatus includes a package having a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view. The package includes first and second leadframes and a resin portion. The first leadframe has a first leadframe main portion and a first leadframe extension portion which has narrower width than that of the first leadframe main portion. The second leadframe has a second leadframe main portion and a second leadframe extension portion which has narrower width than that of the second leadframe main portion. An inclined portion is formed between the first leadframe and the second leadframe as viewed in plan view. An upper end of the inclined portion is shifted from a lower end of the inclined portion.Type: ApplicationFiled: May 2, 2018Publication date: September 6, 2018Applicant: NICHIA CORPORATIONInventors: Shimpei SASAOKA, Takuya NAKABAYASHI
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Patent number: 10069056Abstract: A light emitting device includes a resin package and a light emitting element. The resin package includes a first lead, a second lead, and a molded body molded integrally with the first lead and the second lead. The light emitting element is provided on the resin package.Type: GrantFiled: October 6, 2017Date of Patent: September 4, 2018Assignee: NICHIA CORPORATIONInventors: Ryohei Yamashita, Shimpei Sasaoka
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Patent number: 10050186Abstract: A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded resin part. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the two leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the two leads includes a groove at an upper surface thereof. The groove is filled with a part of the molded resin part. The part of the molded resin part includes a first portion and a second portion. The first portion is exposed from the bottom surface of the recess. The second portion connects with a bottom surface of the side wall.Type: GrantFiled: May 2, 2016Date of Patent: August 14, 2018Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Takuya Nakabayashi
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Patent number: 9991432Abstract: A light emitting apparatus includes a package and at least one light emitting device. The package has a package bottom surface and defining a recessed portion having a recessed portion bottom surface. The package includes a first leadframe, a second leadframe, and a resin portion. The first leadframe has a first leadframe upper surface and a first leadframe bottom surface. The second leadframe has a second leadframe upper surface and a second leadframe bottom surface. The first leadframe has a first leadframe main portion and a first leadframe extension portion. A first recessed part is formed at the first leadframe bottom surface and embedded with the resin portion. The first leadframe forms a second recessed part at an upper surface thereof other than an area approximately above the first recessed part, while the second recessed part is not provided on the area approximately above the first recessed part.Type: GrantFiled: April 3, 2017Date of Patent: June 5, 2018Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Takuya Nakabayashi
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Patent number: 9991237Abstract: A light emitting device includes a base, a first light emitting element, a second light emitting element, and a sealing member. The first light emitting element has an active layer of a nitride semiconductor and has a first emission peak wavelength in a blue region. The second light emitting element has an active layer of a nitride semiconductor and has a second emission peak wavelength longer than the first emission peak wavelength of the first light emitting element. The sealing member includes a first region and a second region. The first region contains a phosphor to be excited by light from the first light emitting element. The first region is provided on an element mounting surface. A first upper surface of the first light emitting element is located in the first region. The second region does not substantially contain the phosphor and is provided on the first region.Type: GrantFiled: September 18, 2015Date of Patent: June 5, 2018Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Kazuto Okamoto
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Patent number: 9893255Abstract: A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the leads includes a groove formed on an upper surface thereof partially below the side wall. The first lead includes an additional groove provided on an upper surface thereof along a side of the first lead positioned opposite a side of the second lead.Type: GrantFiled: May 2, 2016Date of Patent: February 13, 2018Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Takuya Nakabayashi
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Publication number: 20180040791Abstract: A light emitting device includes a resin package and a light emitting element. The resin package includes a first lead, a second lead, and a molded body molded integrally with the first lead and the second lead. The light emitting element is provided on the resin package.Type: ApplicationFiled: October 6, 2017Publication date: February 8, 2018Applicant: NICHIA CORPORATIONInventors: Ryohei YAMASHITA, Shimpei SASAOKA
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Publication number: 20170345986Abstract: A light-emitting device includes: a resin package including: a first lead, a second lead, and a resin portion, wherein each of the first lead and the second lead has a top surface and a bottom surface and comprises a metal layer formed at least at the top surfaces; a light-emitting element electrically connected to the first lead and the second lead; and a protection element located on a first surface portion of the top surface of the first lead. The first lead includes: a first lateral portion and at least one second lateral portion. A second surface portion is formed at the top surface of the first lead between the protection element and at least one of the first lateral portion and the at least one second lateral portion, the second surface portion being embedded in the resin portion and extending in a height direction.Type: ApplicationFiled: May 31, 2017Publication date: November 30, 2017Applicant: NICHIA CORPORATIONInventor: Shimpei SASAOKA
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Patent number: 9812627Abstract: A light emitting device includes a resin package including a first lead and a second lead. A light emitting element includes a first electrode disposed to face the first lead and having a first post electrode projecting toward the first lead in a first projecting direction with a height equal to or larger than 50 ?m and equal to or smaller than 150 ?m in the first projecting direction and a second electrode disposed to face the second lead and having a second post electrode projecting toward the second lead in a second projecting direction with a height equal to or larger than 50 ?m and equal to or smaller than 150 ?m in the second projecting direction. A first electrically conductive bonding member connects the first lead and the first post electrode. A second electrically conductive bonding member connects the second lead and the second post electrode.Type: GrantFiled: January 27, 2017Date of Patent: November 7, 2017Assignee: NICHIA CORPORATIONInventors: Ryohei Yamashita, Shimpei Sasaoka
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Publication number: 20170213945Abstract: A light emitting device includes a resin package including a first lead and a second lead. A light emitting element includes a first electrode disposed to face the first lead and having a first post electrode projecting toward the first lead in a first projecting direction with a height equal to or larger than 50 ?m and equal to or smaller than 150 ?m in the first projecting direction and a second electrode disposed to face the second lead and having a second post electrode projecting toward the second lead in a second projecting direction with a height equal to or larger than 50 ?m and equal to or smaller than 150 ?m in the second projecting direction. A first electrically conductive bonding member connects the first lead and the first post electrode. A second electrically conductive bonding member connects the second lead and the second post electrode.Type: ApplicationFiled: January 27, 2017Publication date: July 27, 2017Applicant: NICHIA CORPORATIONInventors: Ryohei YAMASHITA, Shimpei SASAOKA
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Publication number: 20170207377Abstract: A light emitting apparatus includes a package and at least one light emitting device. The package has a package bottom surface and defining a recessed portion having a recessed portion bottom surface. The package includes a first leadframe, a second leadframe, and a resin portion. The first leadframe has a first leadframe upper surface and a first leadframe bottom surface. The second leadframe has a second leadframe upper surface and a second leadframe bottom surface. The first leadframe has a first leadframe main portion and a first leadframe extension portion. A first recessed part is formed at the first leadframe bottom surface and embedded with the resin portion. The first leadframe forms a second recessed part at an upper surface thereof other than an area approximately above the first recessed part, while the second recessed part is not provided on the area approximately above the first recessed part.Type: ApplicationFiled: April 3, 2017Publication date: July 20, 2017Applicant: NICHIA CORPORATIONInventors: Shimpei SASAOKA, Takuya NAKABAYASHI
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Publication number: 20170141273Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.Type: ApplicationFiled: November 23, 2016Publication date: May 18, 2017Applicant: NICHIA CORPORATIONInventors: Hirofumi ICHIKAWA, Masaki HAYASHI, Shimpei SASAOKA, Tomohide MIKI
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Patent number: 9647190Abstract: A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.Type: GrantFiled: June 27, 2016Date of Patent: May 9, 2017Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Takuya Nakabayashi
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Patent number: 9583422Abstract: A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at least one terminal region arranged inside and held to a rectangular outer frame region, which is a part of the partition frame and forms a boundary of the lead frame as a product unit, via respective suspension leads. Only two suspension leads hold the non-mirrorsymmetric pad region to the outer frame region as extending from opposite sides of the outer frame region to the non-mirrorsymmetric pad region, respectively. This structure decreases stress resulting from holding of the non-mirrorsymmetric pad region to the outer frame region and thus can prevent the outer frame region from deformation without widened connecting bars or dambars, which form the outer frame region.Type: GrantFiled: January 21, 2016Date of Patent: February 28, 2017Assignees: SH MATERIALS CO., LTD., NICHIA CORPORATIONInventors: Katsuyuki Doumae, Yoshio Ichihara, Shimpei Sasaoka
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Patent number: 9537071Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.Type: GrantFiled: October 30, 2015Date of Patent: January 3, 2017Assignee: NICHIA CORPORATIONInventors: Hirofumi Ichikawa, Masaki Hayashi, Shimpei Sasaoka, Tomohide Miki
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Patent number: 9490411Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.Type: GrantFiled: October 30, 2015Date of Patent: November 8, 2016Assignee: NICHIA CORPORATIONInventors: Hirofumi Ichikawa, Masaki Hayashi, Shimpei Sasaoka, Tomohide Miki
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Publication number: 20160308104Abstract: A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.Type: ApplicationFiled: June 27, 2016Publication date: October 20, 2016Applicant: NICHIA CORPORATIONInventors: Shimpei SASAOKA, Takuya NAKABAYASHI
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Publication number: 20160247991Abstract: A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded resin part. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the two leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the two leads includes a groove at an upper surface threreof. The groove is filled with a part of the molded resin part. The part of the molded resin part includes a first portion and a second portion. The first portion is exposed from the bottom surface of the recess. The second portion connects with a bottom surface of the side wall.Type: ApplicationFiled: May 2, 2016Publication date: August 25, 2016Applicant: NICHIA CORPORATIONInventors: Shimpei SASAOKA, Takuya NAKABAYASHI
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Publication number: 20160247979Abstract: A molded package includes a recess, leads, and a molded resin part. The leads include a first lead and a second lead. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the leads includes a groove formed on an upper surface thereof partially below the side wall. The first lead includes an additional groove provided on an upper surface thereof along a side of the first lead positioned opposite a side of the second lead.Type: ApplicationFiled: May 2, 2016Publication date: August 25, 2016Applicant: NICHIA CORPORATIONInventors: Shimpei SASAOKA, Takuya NAKABAYASHI
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Patent number: 9406856Abstract: The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.Type: GrantFiled: June 26, 2014Date of Patent: August 2, 2016Assignee: NICHIA CORPORATIONInventors: Shimpei Sasaoka, Takuya Nakabayashi