Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A semiconductor package includes a plate-like semiconductor element having a first power terminal and a control terminal on a main surface, and a second power terminal on a rear surface; a first power electrode plate positioned to face with the main surface of the semiconductor element, and including a first power electrode joined to the first power terminal by soldering; a second power electrode plate positioned to face with the rear surface of the semiconductor element, and including a second power electrode joined to the second power terminal by soldering; and an insulating substrate positioned between the semiconductor element and the first electrode plate, and including a control electrode joined to the control terminal by soldering.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A semiconductor device includes a pair of semiconductor switching elements and a board. Each semiconductor switching element has positive and control electrodes formed on one surface and a negative electrode formed on the other surface. The positive and control electrodes of one of the semiconductor switching elements are joined to the board, and the negative electrode of the other semiconductor switching element, which faces in a direction opposite to that of one of the semiconductor switching elements, is joined to the board.

Abstract: This invention provides a memory card device using an EEPROM as a semiconductor memory. When a data write-in defective area is detected in the storage area of the EEPROM, a space area is retrieved from the storage area of the EEPROM as a relieving area and data to be written into the data write-in defective area is written into the relieving area. Then, when the relieving area becomes full and a data write-in defective area is detected in the storage area of the EEPROM, another space area is retrieved from the storage area of the EEPROM as a new relieving area and data to be written into the data write-in defective area is written into the new relieving area.

Abstract: A circuit substrate which is formed by fixing a wiring pattern on an insulated substrate has a shielding member for absorbing or reflecting radio waves formed on a first electronic component electrically connected. A shielding layer for absorbing or reflecting radio waves is formed on the circuit substrate. And, a second electronic component is disposed between the first electronic component and the shielding layer.

Abstract: A memory card apparatus has an EEPROM as a semiconductor memory. Each time data is written in the EEPROM, link data representing a recording location of the data is written and managed in a link table. The link table has a flag region with a flag which is set when data write in the EEPROM is requested and is reset when the link data has completely been written in the link table. In case of card removal during operation or power failure, the flag set in the flag region of the link table is not reset and remains. Thus, by checking the flag area of the link table, the occurrence of card removal during operation or power failure can be detected, and various countermeasures can be conducted. Thus, the correspondency between the recorded contents in the EEPROM and the contents in the link table can be maintained as much as possible.

Abstract: A memory card apparatus using EEPROMs as semiconductor memories. Externally input data are temporarily recorded in a buffer memory and are subsequently written in the EEPROMs. Verify processing is automatically performed between the buffer memory and the EEPROMs. Similarly, data read out from the EEPROMs are temporarily recorded in the buffer memory and are subsequently output to an external unit. Even with the EEPROMs, it seems that this memory card can be used in the same manner as a memory card using an SRAM, when viewed from the outside of the card.

Abstract: The present invention relates to a memory card apparatus. When one of blocks of a data area of an EEPROM is detected as a defective block, a save area is searched for a vacant block, and data, which is to be written to the defective block, is written to the vacant block of the data area. When the save area is occupied and one of blocks of the data area is detected as a defective block, the data area is searched for a vacant block, and data, which is to be written to the defective block, is written to the vacant block of the data area. When a block of the data area is used for saving the defective block and a vacant block is generated in the save area by erasing data, data of the block of the data area used for saving the defective block is transferred to the vacant block.