Patents by Inventor Shin-ae Yang

Shin-ae Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100317759
    Abstract: Disclosed is a method for manufacturing an adhesive sheet, including the steps of: (i) forming polymer syrup using monomer for adhesive polymer resin; (ii) injecting gas into the polymer syrup to form bubbles; (iii) forming an adhesive mixture by adding a conductive filler to the polymer syrup having the bubbles and mixing the conductive filler with the polymer syrup; (iv) manufacturing the mixture in a form of a sheet; and (v) irradiating light onto at least two surfaces of the sheet to photopolymerize the adhesive mixture. Gas is injected into polymer syrup before the conductive filler is added to the polymer syrup to form bubbles, thereby obtaining an adhesive sheet capable of shielding and/or absorbing an electromagnetic radiation with dimensional stability and adhesive force superior to that of comparative adhesive sheets.
    Type: Application
    Filed: November 21, 2008
    Publication date: December 16, 2010
    Inventors: Jung-Hyun Ryu, Jeongwan Choi, Jin-Woo Park, Shin-ae Yang