Patents by Inventor Shin-An Chen

Shin-An Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084450
    Abstract: A shower head structure and a plasma processing apparatus are provided. The shower head structure includes a plate body with a first zone and a second zone on a first surface. A plurality of first through holes are in the first zone, each of the first through holes having a diameter uniform with others of the first through holes. A plurality of second through holes are in the second zone. The first zone is in connection with the second zone, and the diameter of each of the first through holes is greater than a diameter of each of the second through holes. A plasma processing apparatus includes the shower head structure is also provided.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: HUAN-CHIEH CHEN, JHIH-REN LIN, TAI-PIN LIU, SHYUE-SHIN TSAI, KEITH KUANG-KUO KOAI
  • Publication number: 20240088095
    Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: Chin-Hua WANG, Shin-Puu JENG, Po-Yao LIN, Po-Chen LAI, Shu-Shen YEH, Ming-Chih YEW, Yu-Sheng LIN
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Patent number: 11915991
    Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Shen Yeh, Po-Yao Lin, Yu-Sheng Lin, Po-Chen Lai, Shin-Puu Jeng
  • Patent number: 11879015
    Abstract: The present disclosure provides antibodies that bind to OX40 and antigen binding fragments thereof, and use of the antibodies and the antigen binding fragments in the treatment of diseases for example cancers. The antibodies or the antigen binding fragments include a heavy chain variable region including one or more CDRs having an amino acid sequence selected from amino acid sequences as set forth in SEQ ID NOs: 1-12.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: January 23, 2024
    Assignee: BIODURO (BEIJING) CO., LTD.
    Inventors: Xiang Li, Guoqian Sun, Chenguang Cai, Shiying Fu, Ting Yang, Shuang Zhao, Ying Li, Xinyue Dai, Qi Sun, Fengzhi Zhang, Youyou Lin, Yu Chen, Zhengfei Xue, Hui Pang, Ying Bai, Shin-chen Hou
  • Patent number: 11870512
    Abstract: A closed-loop power control (CLPC) system is disclosed that includes a first signal path for a first polarization and a second signal path for a second polarization. The first signal path includes a first power amplifier, a first output power detector configured to detect a first output power level of the first power amplifier, and a first processor configured to determine a first analog gain for a first controller and a first gain for a first digital-to-analog converter based on a first accumulated error between the first output power level and a target Effective Isotropically Radiated Power. A second processor is configured to set a first variable gain of a first variable gain amplifier coupled to an input of the first power amplifier. The CLPC can be configured to control the gain of the first signal path separately or as one signal path.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: January 9, 2024
    Inventors: Yanru Tang, Pranav Dayal, Hou-Shin Chen, Pritesh Vora, Tienyu Chang, Siuchuang Ivan Lu, Kee-Bong Song
  • Patent number: 11812391
    Abstract: A method of controlling power in a transmission system may include determining a first transmit power of a first transmit path, determining a second transmit power of a second transmit path, and controlling the first transmit path and the second transmit path based on a combination of the first transmit power and the second transmit power. The combination of the first transmit power and the second transmit power may include a sum of the first transmit power and the second transmit power. Controlling the first transmit path and the second transmit path may include determining a first effective power target for the first transmit path based on the first transmit power and the second transmit power, and determining a second effective power target for the second transmit path based on the first transmit power and the second transmit power.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: November 7, 2023
    Inventors: Pranav Dayal, Kee-Bong Song, Hou-Shin Chen, Sung-En Chiu, Karthik Nagarajan
  • Publication number: 20230353195
    Abstract: A closed-loop power control (CLPC) system is disclosed that includes a first signal path for a first polarization and a second signal path for a second polarization. The first signal path includes a first power amplifier, a first output power detector configured to detect a first output power level of the first power amplifier, and a first processor configured to determine a first analog gain for a first controller and a first gain for a first digital-to-analog converter based on a first accumulated error between the first output power level and a target Effective Isotropically Radiated Power. A second processor is configured to set a first variable gain of a first variable gain amplifier coupled to an input of the first power amplifier. The CLPC can be configured to control the gain of the first signal path separately or as one signal path.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: Yanru TANG, Pranav DAYAL, Hou-Shin CHEN, Pritesh VORA, Tienyu CHANG, Siuchuang Ivan LU, Kee-Bong SONG
  • Patent number: 11742566
    Abstract: An antenna structure and a mobile device including the same are provided. The antenna structure is arranged on a metal cover with an opening slot, and includes a radiator, a feeding part, a grounding element, a grounding parasitic element, an extending parasitic element, a substrate, and a matching circuit. The radiator extends along a first direction, and the feeding part is connected to the radiator and extends towards a second direction. The grounding parasitic element includes a branch part and a parasitic element body. The branch part extends from a grounding point towards the opening slot. The parasitic element body is connected to the grounding element through the branch part and extends towards a first direction. The extending parasitic element extends along the first direction. The matching circuit is electrically connected to the radiator, the grounding element, the grounding parasitic element, and the extending parasitic element.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: August 29, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Yuan-Chia Hsu, Chin-Lung Yeh, Wei-Shin Chen
  • Patent number: 11724131
    Abstract: A wearable ultrasonic therapeutic device controlled by a mobile electronic device is provided, which includes a mobile device, at least one ultrasonic probe module and a strap. The mobile device has a mobile device control interface for setting ultrasonic parameters and displaying an echo wave through a specific software interface of the mobile device. The ultrasonic probe module includes at least one ultrasonic transducer and a control circuit corresponding thereto. The ultrasonic transducer generates and receives an ultrasonic wave. The control circuit has the functions of generating/receiving signals, phase regulation, power amplification and matching. One end of the ultrasonic probe module is electrically connected to the mobile device and the other end of the ultrasonic probe module is connected to the strap.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: August 15, 2023
    Assignees: NATIONAL HEALTH RESEARCH INSTITUTES, NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Gin-Shin Chen, Chia-Hsuan Chang, Jung-Chih Chen
  • Publication number: 20230143791
    Abstract: A circuit board structure for mobile PCI express module is applied to conform to PCI Express 4.0 specification. The circuit board structure includes a top signal layer and a bottom signal layer with a core and a conductive copper wire, a power supply layer disposed between the top signal layer and the bottom signal layer, a plurality of first insulating layers disposed between the top signal layer and the power supply layer and between the bottom signal layer and the power supply layer, and a plurality of second insulating layers disposed between the power supply layer and the first insulating layers. The dielectric loss values of the first insulating layer and the second insulating layer are between 0.004 and 0.014, and the length of the conductive cooper wire is between 500 and 2500 mil, so that the signal loss of the mobile PCI express module is less than 8 dB.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 11, 2023
    Inventors: Dong-Rui CHAN, Min-Lun HUANG, Juang-Shin CHEN
  • Publication number: 20230125582
    Abstract: The subject invention relates to two-stage inoculation and two-stage fermentation process which are performed by the inoculation time difference and staged fermentation. In the first stage, yeast, lactic acid bacteria and Acetobacter aceti are inoculated into a fermentation tank to perform primary fermentation to produce primary fermented material. In the second stage, yeast is added into the primary fermented material in a container to perform the secondary fermentation to produce secondary fermented material, and then the secondary fermented material is pasteurized to deactivate yeast, lactic acid bacteria and Acetobacter aceti in the container and stop fermentation reaction. Finally, the secondary fermented material is cooled to ambient temperature to prepare the kombucha fermented beverage preserving active fermentative bacteria and enzyme at ambient temperature. The invention is help to improve the preservation convenience of the kombucha fermented beverage and avoid excessive alcohol concentration.
    Type: Application
    Filed: September 19, 2022
    Publication date: April 27, 2023
    Inventors: Yu-Fen WANG, Kwan-Han CHEN, Hung-Chi HSIAO, Meng-Hsuan CHUANG, Yen-Chung CHEN, Yu-Shin CHEN, Pi-Feng TSAO, Chun-En GAO
  • Publication number: 20230110612
    Abstract: An antenna structure and a mobile device including the same are provided. The antenna structure is arranged on a metal cover with an opening slot, and includes a radiator, a feeding part, a grounding element, a grounding parasitic element, an extending parasitic element, a substrate, and a matching circuit. The radiator extends along a first direction, and the feeding part is connected to the radiator and extends towards a second direction. The grounding parasitic element includes a branch part and a parasitic element body. The branch part extends from a grounding point towards the opening slot. The parasitic element body is connected to the grounding element through the branch part and extends towards a first direction. The extending parasitic element extends along the first direction. The matching circuit is electrically connected to the radiator, the grounding element, the grounding parasitic element, and the extending parasitic element.
    Type: Application
    Filed: March 10, 2022
    Publication date: April 13, 2023
    Inventors: YUAN-CHIA HSU, CHIN-LUNG YEH, WEI-SHIN CHEN
  • Publication number: 20230082170
    Abstract: A method of controlling power in a transmission system may include determining a first transmit power of a first transmit path, determining a second transmit power of a second transmit path, and controlling the first transmit path and the second transmit path based on a combination of the first transmit power and the second transmit power. The combination of the first transmit power and the second transmit power may include a sum of the first transmit power and the second transmit power. Controlling the first transmit path and the second transmit path may include determining a first effective power target for the first transmit path based on the first transmit power and the second transmit power, and determining a second effective power target for the second transmit path based on the first transmit power and the second transmit power.
    Type: Application
    Filed: November 7, 2022
    Publication date: March 16, 2023
    Inventors: Pranav DAYAL, Kee-Bong SONG, Hou-Shin CHEN, Sung-En CHIU, Karthik NAGARAJAN
  • Publication number: 20230082451
    Abstract: An intelligent zooming method and an electronic device using the same are provided. The intelligent zooming method includes the following steps. A text paragraph corresponding to the text is merged. The text paragraph is automatically arranged according to the text paragraph and a text magnification box. The text paragraph in the text magnification box is enlarged according to a text magnification ratio. A block group containing the block and other blocks connected thereto is merged. A block magnification ratio is adjusted according to the block group and a block magnification box. The block group in the block magnification box is enlarged according to the block magnification ratio. The picture is cropped to obtain an object. A picture magnification ratio is adjusted according to the object and a picture magnification box. The object in the picture magnification box is enlarged according to the picture magnification ratio.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 16, 2023
    Applicant: Acer Incorporated
    Inventors: En-Shin CHEN, An-Cheng LEE, Hsu-Yang CHANG, Ying-Shih HUNG
  • Publication number: 20230059663
    Abstract: A wearable ultrasonic therapeutic device controlled by a mobile electronic device is provided, which includes a mobile device, at least one ultrasonic probe module and a strap. The mobile device has a mobile device control interface for setting ultrasonic parameters and displaying an echo wave through a specific software interface of the mobile device. The ultrasonic probe module includes at least one ultrasonic transducer and a control circuit corresponding thereto. The ultrasonic transducer generates and receives an ultrasonic wave. The control circuit has the functions of generating/receiving signals, phase regulation, power amplification and matching. One end of the ultrasonic probe module is electrically connected to the mobile device and the other end of the ultrasonic probe module is connected to the strap.
    Type: Application
    Filed: November 24, 2021
    Publication date: February 23, 2023
    Inventors: GIN-SHIN CHEN, CHIA-HSUAN CHANG, JUNG-CHIH CHEN
  • Patent number: 11496969
    Abstract: A method of controlling power in a transmission system may include determining a first transmit power of a first transmit path, determining a second transmit power of a second transmit path, and controlling the first transmit path and the second transmit path based on a combination of the first transmit power and the second transmit power. The combination of the first transmit power and the second transmit power may include a sum of the first transmit power and the second transmit power. Controlling the first transmit path and the second transmit path may include determining a first effective power target for the first transmit path based on the first transmit power and the second transmit power, and determining a second effective power target for the second transmit path based on the first transmit power and the second transmit power.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: November 8, 2022
    Inventors: Pranav Dayal, Kee-Bong Song, Hou-Shin Chen, Sung-En Chiu, Karthik Nagarajan
  • Publication number: 20220348670
    Abstract: The present disclosure provides antibodies that bind to OX40 and antigen binding fragments thereof, and use of the antibodies and the antigen binding fragments in the treatment of diseases for example cancers. The antibodies or the antigen binding fragments include a heavy chain variable region including one or more CDRs having an amino acid sequence selected from amino acid sequences as set forth in SEQ ID NOs: 1-12.
    Type: Application
    Filed: April 29, 2022
    Publication date: November 3, 2022
    Inventors: Xiang LI, Guoqian SUN, Chenguang CAI, Shiying FU, Ting YANG, Shuang ZHAO, Ying LI, Xinyue DAI, Qi SUN, Fengzhi ZHANG, Youyou LIN, Yu CHEN, Zhengfei XUE, Hui PANG, Ying BAI, Shin-chen Hou
  • Publication number: 20220320289
    Abstract: High-voltage semiconductor device and method of forming the same, the high-voltage semiconductor device includes a substrate, a gate structure, a drain, a first insulating structure and a drain doped region. The gate structure is disposed on the substrate. The drain is disposed in the substrate, at one side of the gate structure. The first insulating structure is disposed on the substrate, under the gate structure to partially overlap with the gate structure. The drain doped region is disposed in the substrate, under the drain and the first insulating structure, and the drain doped region includes a discontinuous bottom surface.
    Type: Application
    Filed: June 22, 2022
    Publication date: October 6, 2022
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Wen-Hsin Lin, Shin-Chen Lin, Yu-Hao Ho, Cheng-Tsung Wu, Chiu-Hao Chen