Patents by Inventor Shin?apos;ichi Kuwamura

Shin?apos;ichi Kuwamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020065362
    Abstract: An emulsion of a monomer having a radical polymerizable unsaturated bond, which is obtained by emulsifying the monomer in the presence of an emulsifier, and a mixed solution of a specific non-radical polymerizable organosilicon compound and a polymerization initiator, which is soluble in the non-radical polymerizable organosilicon compound, are added to an aqueous medium, followed by emulsion polymerization, hydrolysis, and condensation, to produce a waterborne resin emulsion and a waterborne coating which can form a coating film having superior durability such as water resistance, weathering resistance, or the like.
    Type: Application
    Filed: October 9, 2001
    Publication date: May 30, 2002
    Applicant: Dainippon Ink and Chemicals, Inc.
    Inventors: Masahito Furo, Shin?apos; ichi Kuwamura
  • Publication number: 20020045683
    Abstract: An object is to remarkably improve the water resistance and weather resistance of the cured coating film in the aqueous curable resin composition. An aqueous dispersion is used as a main agent which contains, as essential components, gel-like resin dispersed particles having a functional group selected from a salt of a tertiary amino group or a salt of an acid group and an aqueous medium, and a compound having both an epoxy group and a hydrolyzable silyl group is used as a curing agent.
    Type: Application
    Filed: June 28, 2001
    Publication date: April 18, 2002
    Inventors: Teruki Kiyohara, Shin?apos;ichi Kuwamura