Patents by Inventor Shin Beom Kim

Shin Beom Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250257462
    Abstract: Disclosed is a method of depositing thin films, the method comprising supplying a metal precursor to the inside of a chamber where a substrate is placed to adsorb the metal precursor onto the substrate; purging the inside of the chamber; supplying a reactant to the inside of the chamber to react with the adsorbed metal precursor and form a thin film, wherein the metal precursor includes one or more halogen groups and one or more organic ligands.
    Type: Application
    Filed: February 7, 2025
    Publication date: August 14, 2025
    Applicant: EGTM Co., Ltd.
    Inventors: Kyu Ho CHO, Ha Na KIM, Hyun Ju JUNG, Ju Hwan JEONG, Hyeon Sik CHO, Sun Young BAIK, Tae Young LEE, Shin Beom KIM
  • Publication number: 20250201549
    Abstract: A precursor for forming a silicon-containing thin film according to an embodiment of the present disclosure is a compound represented by the following Chemical Formula 1 or 2, in which in Chemical Formulas 1 and 2, A is a cycloalkyl group having 4 to 7 carbon atoms, R1, R4 and R5 are each independently selected from hydrogen; and a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, and R2, R3 and R6 are each independently an alkyl group having 1 or 2 carbon atoms. Accordingly, it is possible to provide a silicon-containing thin film with high hardness and low dielectric constant characteristics using a silicon precursor having an asymmetric structure containing a cycloalkyl group.
    Type: Application
    Filed: November 20, 2024
    Publication date: June 19, 2025
    Applicant: EGTM Co., Ltd.
    Inventors: Sung Jun Ji, Sun Young Baik, Tae Young Lee, Shin Beom Kim, Woong Jin Choi, Kun Hee Kim
  • Patent number: 11958874
    Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: April 16, 2024
    Assignees: EGTM Co., Ltd., SK hynix Inc.
    Inventors: Jang Keun Sim, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
  • Patent number: 11926897
    Abstract: According to an embodiment of the present disclosure, a niobium precursor compound is represented by Chemical Formula 1 or Chemical Formula 2 below: Therefore, the niobium precursor compound according to an embodiment of the present disclosure has excellent thermal stability, exists in a liquid state at room temperature, and has high volatility, thereby having an advantage which is advantageous for application to a thin film forming process. Further, the niobium thin film formed using the niobium precursor compound according to an embodiment of the present disclosure has a small residual content and has uniform physical properties.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: March 12, 2024
    Assignee: EGTM Co., Ltd.
    Inventors: Tae Young Lee, Sung Jun Ji, Shin Beom Kim, Sun Young Baik
  • Publication number: 20230339985
    Abstract: According to examples of the present disclosure, the organometallic compound is represented by Formula 1 below, which is used as a precursor when a Group 4 metal-containing thin film is deposited to provide a high-quality Group 4 metal-containing thin film. In Formula 1, M is Zr or Hf, R1 is selected from a linear alkyl group having 2 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, R2 is a linear alkyl group having 1 to 3 carbon atoms, and R1 and R2 are different from each other.
    Type: Application
    Filed: April 17, 2023
    Publication date: October 26, 2023
    Inventors: Sung Jun JI, Kyuho CHO, Sun Young BAIK, Ju Hwan JEONG, Tae Young LEE, Shin Beom KIM, Woong Jin CHOI
  • Publication number: 20230101446
    Abstract: According to an embodiment of the present disclosure, a niobium precursor compound is represented by Chemical Formula 1 or Chemical Formula 2 below: Therefore, the niobium precursor compound according to an embodiment of the present disclosure has excellent thermal stability, exists in a liquid state at room temperature, and has high volatility, thereby having an advantage which is advantageous for application to a thin film forming process. Further, the niobium thin film formed using the niobium precursor compound according to an embodiment of the present disclosure has a small residual content and has uniform physical properties.
    Type: Application
    Filed: May 25, 2022
    Publication date: March 30, 2023
    Inventors: Tae Young LEE, Sung Jun JI, Shin Beom KIM, Sun Young BAIK
  • Publication number: 20220402946
    Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
    Type: Application
    Filed: April 11, 2022
    Publication date: December 22, 2022
    Inventors: Jang Keun SIM, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun