Abstract: The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.

Abstract: The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.

Abstract: The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.

Abstract: Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.

Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.

Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.

Abstract: The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.

Abstract: The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.

Abstract: The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.

Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

Abstract: A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.

Abstract: Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.

Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.

Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.