Patents by Inventor Shin-Chi Hsieh

Shin-Chi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tool-less air baffle
    Patent number: 9674983
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: June 6, 2017
    Assignee: Dell Products L.P.
    Inventors: Chin-An Huang, Chen-Fa Wu, Shin-Chi Hsieh
  • TOOL-LESS AIR BAFFLE
    Publication number: 20170127562
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 4, 2017
    Inventors: Chin-An Huang, Chen-Fa Wu, Shin-Chi Hsieh