Patents by Inventor Shin-Chi Hsieh

Shin-Chi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146205
    Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.
    Type: Application
    Filed: September 23, 2023
    Publication date: May 2, 2024
    Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
  • Patent number: 9674983
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: June 6, 2017
    Assignee: Dell Products L.P.
    Inventors: Chin-An Huang, Chen-Fa Wu, Shin-Chi Hsieh
  • Publication number: 20170127562
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 4, 2017
    Inventors: Chin-An Huang, Chen-Fa Wu, Shin-Chi Hsieh