Patents by Inventor Shin-Chieh Chen

Shin-Chieh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146205
    Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.
    Type: Application
    Filed: September 23, 2023
    Publication date: May 2, 2024
    Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
  • Patent number: 7264044
    Abstract: A heat exchange structure includes at least three wave-shaped non-woven cloth layers. Each wave-shaped non-woven cloth layer has a plurality of crest tops and trough bottoms. Adjacent wave-shaped non-woven cloth layers are interconnected at intersections of crest tops and trough bottoms thereof. Each wave-shaped non-woven cloth layer forms a unique flow channel. When a cool airflow and a hot airflow are respectively introduced into flow channels formed by adjacent wave-shaped non-woven cloth layers, a heat exchange is executed at the wave-shaped non-woven cloth layer between the cool airflow and the hot airflow.
    Type: Grant
    Filed: July 29, 2005
    Date of Patent: September 4, 2007
    Assignee: Taiwan Textile Research Institute
    Inventors: Cheng-Kun Chu, Yen-Hsi Lin, Shin-Chieh Chen
  • Publication number: 20070148399
    Abstract: A method of fabricating a conductive textile is provided. First, erect-interlaced fibers are formed on a textile. Then, a conductive layer is formed on the erect-interlaced fibers and the surface of the textile to form a conductive textile.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Inventor: Shin-Chieh Chen
  • Publication number: 20060144575
    Abstract: A heat exchange structure includes at least three wave-shaped non-woven cloth layers. Each wave-shaped non-woven cloth layer has a plurality of crest tops and trough bottoms. Adjacent wave-shaped non-woven cloth layers are interconnected at intersections of crest tops and trough bottoms thereof. Each wave-shaped non-woven cloth layer forms a unique flow channel. When a cool airflow and a hot airflow are respectively introduced into flow channels formed by adjacent wave-shaped non-woven cloth layers, a heat exchange is executed at the wave-shaped non-woven cloth layer between the cool airflow and the hot airflow.
    Type: Application
    Filed: July 29, 2005
    Publication date: July 6, 2006
    Inventors: Cheng-Kun Chu, Yen-Hsi Lin, Shin-Chieh Chen
  • Publication number: 20060134390
    Abstract: A method for producing durably anti-microbial yarns is disclosed. An inorganic anti-microbial material is formed on at least one surface of a knitted fabric by a physical vapor deposition method, and then the knitted fabric is deknitted to anti-microbial yarns. The anti-microbial yarns provide a better wash ability and durably anti-microbial effect, and are suitable to be blended with other yarns to a softer anti-microbial fabric.
    Type: Application
    Filed: December 1, 2005
    Publication date: June 22, 2006
    Inventors: Jan-Min Lin, Shin-Chieh Chen, Tzu-Shiang Huang