Patents by Inventor Shin Chiu

Shin Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240297650
    Abstract: An input/output circuit (I/O circuit) includes the following elements. An input/output pad (I/O pad) has a plurality of operation mode, including an output mode, a normal input mode and a tolerance mode of an input mode. A first control circuit provides a first control signal in response to a pad voltage of the I/O pad and a supply voltage. A first P-type transistor has a first body region to receive a first control signal. A second P-type transistor has a second body region to receive the first control signal. In the input mode, when the pad voltage is lower than or equal to the supply voltage, the I/O pad operates in the normal input mode, and, when the pad voltage is higher than the supply voltage, the I/O pad operates in the tolerance mode, and voltage of the first control signal is equal to pad voltage.
    Type: Application
    Filed: March 28, 2023
    Publication date: September 5, 2024
    Inventors: Pei-Shin CHIU, Te-Chang WU, Chih-Yuan CHUNG, Wen-Ching HUANG
  • Patent number: 7633160
    Abstract: A window-type semiconductor package is disclosed to avoid peeling at the moldflow entrance, primarily comprising a substrate, a chip with the active surface attached to the substrate, a die-attaching layer bonding the active surface of the chip to a substrate core of the substrate, a plurality of bonding wires, and an encapsulant. The substrate core has a slot. One end of the slot outside the chip is formed as a moldflow entrance with two or more moldflow blocking lumps protrusively disposed on the substrate core and located at the intersections between one edge of the chip and the two opposing sides of the slot adjacent to the moldflow entrance. Accordingly, the moldflow pressures exerting at the die-attaching layer are blocked to avoid the peeling of the die-attaching layer at the moldflow entrance and to keep a constant die-attaching gap.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: December 15, 2009
    Assignee: Powertech Technology Inc.
    Inventors: Chuang-Fa Lee, Chao-Hsiang Leu, Tseng-Shin Chiu
  • Publication number: 20080272480
    Abstract: An LGA (Land Grid Array) semiconductor package mainly comprises a substrate, a chip, a soldering layer and a foot stand. The chip is disposed on a top surface of the substrate and is electrically connected to a plurality of metal pads formed on a bottom surface of the substrate. The soldering layer is disposed on the metal pads with a first thickness slightly protruded from the bottom surface of the substrate. Additionally, the foot stand is disposed under the substrate with a second thickness protruded from the bottom surface of the substrate, wherein the second thickness is greater than the first thickness. Therefore, the soldering layer of the LGA semiconductor package is free from scratches and damages during shipping and handling processes. Moreover, the LGA semiconductor package can be surface-mounted to a printed circuit board with pre-applied solder or pre-mounted solder balls to increase the implementations of LGA semiconductor packages.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 6, 2008
    Inventors: Chia-Yu Hung, Chao-Hsiang Leu, Tseng-Shin Chiu
  • Patent number: 7408245
    Abstract: A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: August 5, 2008
    Assignee: Powertech Technology Inc.
    Inventors: Chia-Yu Hung, Chao-Hsiang Leu, Tseng-Shin Chiu
  • Publication number: 20080150100
    Abstract: A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel.
    Type: Application
    Filed: December 22, 2006
    Publication date: June 26, 2008
    Inventors: Chia-Yu Hung, Chao-Hsiang Leu, Tseng-Shin Chiu
  • Publication number: 20070290332
    Abstract: A stacking structure of chip package disclosed herein includes a lead frame having a plurality of supporting fingers and a plurality of leads; a first chip arranged on one side of the lead frame by utilizing a first connecting element so as to partially cover these supporting fingers, wherein the supporting fingers stretch from the edge of the first chip toward the first chip to provide a support; a second chip arranged on the opposite side of the lead frame at the corresponding position of the first chip by utilizing a second connecting element to partially covering the supporting fingers, wherein the first chip, the second chip and the partially-covered supporting fingers are cooperated to define an open mold-flowing trench; an electrical-connecting element to electrically connect the first chip, the second chip and the leads; and a molding compound utilized to cover the first chip, the second chip, the electrical-connecting element and some of the lead frame, wherein the molding compound flows through the
    Type: Application
    Filed: June 15, 2006
    Publication date: December 20, 2007
    Inventors: Tseng Shin Chiu, Chia-Yu Hung
  • Publication number: 20070260555
    Abstract: Embodiments of the present invention include methods, systems and apparatuses for conducting secure transactions over a call. Users can initiate a secure transaction over a call, such as a telephone call, in which the identities of up to all participants can be validated prior to sending or receiving of payment, financial or other sensitive information. A transaction module collects and verifies all necessary transaction information and resources. User can be prompted to confirm or approve the transaction prior to completion of the transaction. Summaries of the transaction can be sent to users or stored in record keeping.
    Type: Application
    Filed: August 3, 2005
    Publication date: November 8, 2007
    Applicant: TP Lab
    Inventors: Chi Ho, Shin Chiu
  • Publication number: 20070189269
    Abstract: Provided is a method and system for multiple party telephone calls. The method includes receiving an incoming voice telephone call from a call network at a multi-party module, and allowing, by the multi-party module, for a plurality of terminal modules to participate in the incoming voice telephone call, each terminal module comprising a telephone.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 16, 2007
    Inventors: Chi Ho, Shin Chiu
  • Publication number: 20070118741
    Abstract: Provided is a method and system for authenticating object delivery including the steps of receiving by an object receiver an object delivery information package from an object deliverer over a call network during a communication between the object receiver and the object deliverer, wherein the object delivery information package comprises object information and object deliverer identity information, receiving by the object receiver an object from the object deliverer, and authenticating the receipt of the object by the object receiver using the object information and object deliverer identity information.
    Type: Application
    Filed: November 18, 2005
    Publication date: May 24, 2007
    Inventors: Chi Ho, Shin Chiu
  • Publication number: 20070106521
    Abstract: A preset credit media includes: a document part, and availability information and credit for the document part. The document part is all or less than all of an audio file, a visual file, a text file, or a data file. The availability information includes a monetary cost or time availability for the document part. The credit includes a monetary credit, a time credit, or a transaction credit for the document part. To play the document part, it is determined if enough credit exists for the document part to be played, based on the availability information and the credit. If so, the document part is retrieved from the preset credit media and played. The credit is modified accordingly. To change a preset credit media, a change request is received and verified. Any combination of the document part, the availability information, and the credit may be modified according to the change request.
    Type: Application
    Filed: November 4, 2005
    Publication date: May 10, 2007
    Applicant: TP Lab
    Inventors: Chi Ho, Shin Chiu
  • Patent number: 6075311
    Abstract: Disclosed is a micro-positioning flatbed comprising a bed; a first driving unit and a second driving unit of resilient construction; a piezo-electric element firmly coupling the first and the second driving units; and piezo-electric elements firmly received within the first and the second driving units, wherein the bed is formed with corresponding, extending guides, the first and the second driving units include opposing sides having configurations corresponding to configurations of the guides, and the first and the second driving units are aligned within the guides of the bed, whereby the piezo-electric elements expand or contract while being subjected to voltages to cause lateral expansion or contraction of the first and the second driving units in response to expansion or construction of the piezo-electric elements firmly received within the first and the second driving units, such that the piezo-electric elements firmly coupled to the first and the second driving units activate the first and the second dr
    Type: Grant
    Filed: July 20, 1998
    Date of Patent: June 13, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Jia-Tian Pan, Neng-Shin Chiu, Shao-Yu Hsu, Horng-Ru Wang
  • Patent number: 5649716
    Abstract: An automatic power generating flash wheel assembly comprises at least a fly wheel and at least a coil unit. The fly wheel is enclosed by a transparent outer wheel. At least an inserted groove is formed in the inner periphery of the fly wheel to receive a set of the coil unit. Each of the coil unit has a couple of electrodes at one side and a light-emitting device at the opposite side. The electrodes are disposed toward a pivot. An annular magnet has a recess formed in the inner periphery of the magnet. A protrusion rib on the pivot is inserted through the recess. The magnet touches the electrodes slightly. The magnet is disposed between the first and second annular pivot sockets. The pivot passes through the first pivot socket, the magnet and the second pivot socket. The first pivot socket, the magnet and the second pivot socket are disposed in the fly wheel.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: July 22, 1997
    Inventor: Shin-Chiu Zhang