Patents by Inventor Shin Haeng HEO
Shin Haeng HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967752Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: GrantFiled: January 19, 2021Date of Patent: April 23, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
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Patent number: 11888212Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: GrantFiled: June 24, 2021Date of Patent: January 30, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
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Patent number: 11881642Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: GrantFiled: September 16, 2020Date of Patent: January 23, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Won Cheol Lee, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11777219Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: GrantFiled: April 22, 2020Date of Patent: October 3, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Won Cheol Lee, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11764483Abstract: An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.Type: GrantFiled: June 29, 2020Date of Patent: September 19, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11670870Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: GrantFiled: September 2, 2021Date of Patent: June 6, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Gil Ha Lee, Shin Haeng Heo, Hyung Ho Seo, Hong Cheol Kim
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Patent number: 11264719Abstract: A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.Type: GrantFiled: June 2, 2020Date of Patent: March 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Shin Haeng Heo, Young Sik Hur, Hak Gu Kim
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Patent number: 11228118Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: GrantFiled: October 22, 2019Date of Patent: January 18, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Gil Ha Lee, Shin Haeng Heo, Hyung Ho Seo, Hong Cheol Kim
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Publication number: 20210399436Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Gil Ha LEE, Shin Haeng HEO, Hyung Ho SEO, Hong Cheol KIM
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Publication number: 20210320398Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Publication number: 20210257736Abstract: A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.Type: ApplicationFiled: June 2, 2020Publication date: August 19, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Shin Haeng HEO, Young Sik HUR, Hak Gu KIM
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Publication number: 20210242604Abstract: An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.Type: ApplicationFiled: June 29, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol LEE, Jeong Ki RYOO, Nam Ki KIM, Jae Min KEUM, Dong Ok KO, Shin Haeng HEO
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Publication number: 20210242591Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: ApplicationFiled: September 16, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki KIM, Jeong Ki RYOO, Won Cheol LEE, Jae Min KEUM, Dong Ok KO, Shin Haeng HEO
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Publication number: 20210242590Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: ApplicationFiled: April 22, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki KIM, Jeong Ki RYOO, Won Cheol LEE, Jae Min KEUM, Dong Ok KO, Shin Haeng HEO
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Publication number: 20210143530Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: January 19, 2021Publication date: May 13, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Patent number: 10931000Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: GrantFiled: January 14, 2020Date of Patent: February 23, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
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Publication number: 20210044001Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.Type: ApplicationFiled: January 14, 2020Publication date: February 11, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
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Publication number: 20200403321Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.Type: ApplicationFiled: October 22, 2019Publication date: December 24, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Gil Ha LEE, Shin Haeng HEO, Hyung Ho SEO, Hong Cheol KIM