Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a substrate, a light-shielding layer and an optical material layer. The light-shielding layer is disposed on the substrate. The optical material layer is in contact with the light-shielding layer. The optical material layer includes a non-filtering portion and a filtering portion.

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

Abstract: A method for updating software comprises transmitting a first version of the software and a first decryption key to a computing system. The method further comprises generating a second version of the software and a second decryption key. The method further comprises encrypting the second version of the software and the second decryption key. The encrypted second version of the software is configured to be decrypted using the first decryption key and not the second decryption key. The method further comprises transmitting the encrypted second version of the software and the encrypted second decryption key to the computing system.

Abstract: A semiconductor device and a method for forming the same are provided. The semiconductor device includes a substrate and a gate structure. The gate structure is disposed in the substrate and includes a shielded gate, a control gate, and a plurality of insulating layers. The shielded gate includes a bottom gate and a top gate. The bottom gate includes a step structure consisting of a plurality of electrodes. A width of the electrode is smaller as the electrode is farther away from the top gate, and a width of the top gate is smaller than a width of the electrode closest to the top gate. The control gate is disposed on the shielded gate. A first insulating layer is disposed between the shielded gate and the substrate. A second insulating layer is disposed on the shielded gate. A third insulating layer is disposed between the control gate and the substrate.

Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a substrate, a light-shielding layer and an optical material layer. The light-shielding layer is disposed on the substrate. The optical material layer is in contact with the light-shielding layer. The optical material layer includes a non-filtering portion and a filtering portion.