Patents by Inventor Shinichi Kishimoto

Shinichi Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971203
    Abstract: A refrigerant amount determining device includes: an operation data acquiring unit configured to acquire operation data of an air conditioning system; a calculating unit configured to calculate a refrigerant amount index value from the operation data acquired; an inferring unit configured to infer information regarding correction of the refrigerant amount index value using a correction model and at least one of the acquired operation data or the calculated refrigerant amount index value; and a determining unit configured to determine a refrigerant amount of the air conditioning system based on the information regarding correction of the refrigerant amount index value.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: April 30, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Manabu Yoshimi, Takeshi Hikawa, Shinichi Kasahara, Shohei Yamada, Hiroyuki Kagitani, Hidetaka Kishimoto
  • Publication number: 20230258456
    Abstract: An inertial sensor includes: a plurality of inertial force detection elements each configured to output an output signal corresponding to a detected inertial force; and a processor configured to execute processing relating to the output signal from each of the plurality of inertial force detection elements. The plurality of inertial force detection elements include a first inertial force detection element and a second inertial force detection element. A detection range of the first inertial force detection element and a detection range of the second inertial force detection element are different from each other. A sensitivity of the first inertial force detection element and a sensitivity of the second inertial force detection element are different from each other.
    Type: Application
    Filed: June 24, 2021
    Publication date: August 17, 2023
    Inventor: Shinichi KISHIMOTO
  • Publication number: 20230236015
    Abstract: An inertial sensor includes: a plurality of inertial force detection elements each configured to output an output signal corresponding to a detected inertial force; and a processor configured to execute processing relating to the output signal from each of the plurality of inertial force detection elements. The plurality of inertial force detection elements includes: a plurality of main inertial force detection elements configured to detect inertial forces of a plurality of first predetermined axes orthogonal to each other; and a sub-inertial force detection element configured to detect an inertial force of a second predetermined axis which intersects the plurality of first predetermined axes such that the second predetermined axis is orthogonal to none of the plurality of first predetermined axes.
    Type: Application
    Filed: June 24, 2021
    Publication date: July 27, 2023
    Inventor: Shinichi KISHIMOTO
  • Patent number: 11680797
    Abstract: A physical quantity sensor includes a substrate, an anchor portion, a surrounding portion, a detecting element, a moving portion, and a beam portion. The anchor portion is formed on the same side as a principal surface of the substrate and fixed to the substrate. The surrounding portion is formed on the same side as the principal surface of the substrate and surrounds the anchor portion. The detecting element detects a physical quantity as a target of detection. The moving portion is provided with at least a part of the detecting element, formed on the same side as the principal surface of the substrate, and connected to the surrounding portion. The beam portion is formed on the same side as the principal surface of the substrate and connects the anchor portion and the surrounding portion together.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: June 20, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aoyagi, Hiroyuki Aizawa, Chunzhi Dong, Shinichi Kishimoto
  • Patent number: 11512194
    Abstract: The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 29, 2022
    Assignee: RIKEN TECHNOS CORPORATION
    Inventors: Kaoru Iwasa, Shinichi Kishimoto
  • Publication number: 20220155072
    Abstract: A physical quantity sensor includes a substrate, an anchor portion, a surrounding portion, a detecting element, a moving portion, and a beam portion. The anchor portion is formed on the same side as a principal surface of the substrate and fixed to the substrate. The surrounding portion is formed on the same side as the principal surface of the substrate and surrounds the anchor portion. The detecting element detects a physical quantity as a target of detection. The moving portion is provided with at least a part of the detecting element, formed on the same side as the principal surface of the substrate, and connected to the surrounding portion. The beam portion is formed on the same side as the principal surface of the substrate and connects the anchor portion and the surrounding portion together.
    Type: Application
    Filed: February 19, 2020
    Publication date: May 19, 2022
    Inventors: Takanori AOYAGI, Hiroyuki AIZAWA, Chunzhi DONG, Shinichi KISHIMOTO
  • Patent number: 11320372
    Abstract: A component sensor detects a fluid component with improved accuracy. The component sensor includes tube (3) including tube side (4) that permits inflow of fluid (2), substrate (5) provided to tube (3), first protrusion (6) provided at one end of substrate (5), second protrusion (7) provided at another end of substrate (5), light emitter (9) that emits infrared light (8) toward first protrusion (6), and light receiver (10) that receives infrared light (8). Infrared light (8) entering substrate (5) through first protrusion (6) experiences total reflection inside substrate (5) and exits through second protrusion (7) to head for light receiver (10). Tube side (4) includes two through holes (13) that each extend between an interior and an exterior of tube (3).
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 3, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takafumi Okudo, Shinichi Kishimoto, Masahiko Ohbayashi, Koji Sakai, Hiroki Yoshino
  • Publication number: 20200369865
    Abstract: The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 26, 2020
    Applicant: RIKEN TECHNOS CORPORATION
    Inventors: Kaoru IWASA, Shinichi KISHIMOTO
  • Publication number: 20200232917
    Abstract: A component sensor detects a fluid component with improved accuracy. The component sensor includes tube (3) including tube side (4) that permits inflow of fluid (2), substrate (5) provided to tube (3), first protrusion (6) provided at one end of substrate (5), second protrusion (7) provided at another end of substrate (5), light emitter (9) that emits infrared light (8) toward first protrusion (6), and light receiver (10) that receives infrared light (8). Infrared light (8) entering substrate (5) through first protrusion (6) experiences total reflection inside substrate (5) and exits through second protrusion (7) to head for light receiver (10). Tube side (4) includes two through holes (13) that each extend between an interior and an exterior of tube (3).
    Type: Application
    Filed: October 25, 2018
    Publication date: July 23, 2020
    Inventors: TAKAFUMI OKUDO, SHINICHI KISHIMOTO, MASAHIKO OHBAYASHI, KOJI SAKAI, HIROKI YOSHINO
  • Patent number: 10559407
    Abstract: There are provided a process for producing an electrical wire molded body comprising: step I of melting and kneading a polyethylene-based resin (a), a polypropylene-based resin (b), a block copolymer (c) of an aromatic vinyl-based compound and a conjugated diene-based compound and the like, and a silane coupling agent (g), and other components, to produce a silane crosslinkable flame retardant polyolefin (A); step II of melting and kneading a polymer selected from the components (a) to (c) and a silanol condensation catalyst (i), to produce a silanol catalyst rein composition (B); and step III of mixing the components (A) and (B), melt molding the mixture on a conductor and then crosslinking the molded body in the presence of water.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: February 11, 2020
    Assignee: Riken Technos Corporation
    Inventors: Shinichi Kishimoto, Shinichi Saito, Hideo Ohsawa
  • Publication number: 20190137387
    Abstract: An object of the present disclosure is to provide a device that can be manufactured in a simple process while ensuring a reduction in influence of noise on an electronic component. A device according to the present disclosure, accomplished to fulfill the object, includes light emitting element, light receiving element, electronic component to process signals sent from light receiving element, and optical component cover light emitting element and light receiving element. The device further includes reflector cover a lower surface of optical component and substrate. Reflector has first opening directly above light emitting element and second opening directly above light receiving element. Light emitting element, light receiving element, reflector, electronic component, and optical component are mounted over substrate. Reflector is electrically connected to substrate by a member disposed between reflector and substrate.
    Type: Application
    Filed: May 16, 2017
    Publication date: May 9, 2019
    Inventors: MASAHIKO OHBAYASHI, KOJI SAKAI, RYOSUKE MESHII, SHINICHI KISHIMOTO, AKIRA MATSUURA
  • Publication number: 20180202925
    Abstract: A sensor includes a body having an internal space allowing fluid to flow into the internal space, a light-emitting device that emits light passing through; first and second light-receiving devices that receive the light that has passed through the internal space, a first optical filter disposed between the first light-receiving device and the light-emitting device and configured to pass the light therethrough, a second optical filter disposed between the second light-receiving device and the light-emitting device and configured to pass the light therethrough, and a controller. The controller is configured to change the light emitted from the light-emitting device, and to compare a ratio between first and second outputs before the change of the light to a ratio between the first and second outputs after the change of the light.
    Type: Application
    Filed: September 30, 2016
    Publication date: July 19, 2018
    Inventors: SHINICHI KISHIMOTO, MASAHIKO OHBAYASHI, KOJI SAKAI
  • Publication number: 20180017485
    Abstract: A purpose of the present invention is to provide a sensor with high sensitivity or high target substance selectivity. A sensor that includes a structure having an internal space into which a detection target is capable of flowing, a light-emitting element, and a photo-receptor element is provided. The sensor is disposed so that light emitted from the light-emitting element passes through the internal space to reach the photo-receptor element. A wavelength of the light emitted from the light-emitting element falls within a range from 2.5 ?m to 15 ?m inclusive. A length of the internal space in a direction perpendicular to an extension direction of the structure should preferably be less than or equal to 1000 ?m.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 18, 2018
    Inventors: KOJI SAKAI, SHINICHI KISHIMOTO, DAISUKE WAKABAYASHI
  • Patent number: 9550663
    Abstract: A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: January 24, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuo Goda, Takumi Taura, Shinichi Kishimoto, Hideki Ueda, Takeshi Mori
  • Publication number: 20160091526
    Abstract: A configuration including a first substrate including a first movable electrode; a second substrate connected to the first substrate and including a first fixed electrode that faces the first movable electrode; and a third substrate connected to the second substrate. The first substrate, the second substrate, and the third substrate are laminated in this order, and the second substrate and the third substrate are not bonded to each other in at least a part between the first fixed electrode and the third substrate.
    Type: Application
    Filed: June 10, 2014
    Publication date: March 31, 2016
    Inventors: KAZUO GODA, NOBUYUKI IBARA, HITOSHI YOSHIDA, TAKUMI TAURA, SHINICHI KISHIMOTO, HIDEKI UEDA, TAKESHI MORI
  • Patent number: 9274153
    Abstract: An electrostatic capacitance sensor 1 includes a semiconductor substrate 4. A first fixing plate 2 is joined to a one-side surface 4a of the semiconductor substrate 4, and a second fixing plate 3 is joined to other-side surface 4b of the semiconductor substrate 4, whereby a space portion S is formed. Then, static electricity suppressing means 70 for suppressing static electricity from being generated in the space portion S is provided in the electrostatic capacitance sensor 1.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: March 1, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Katsumi Kakimoto, Hitoshi Yoshida, Nobuyuki Ibara, Shinichi Kishimoto, Hideki Ueda, Takeshi Okada, Takeshi Mori, Masatoshi Nomura, Jun Ogihara
  • Publication number: 20150368089
    Abstract: A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.
    Type: Application
    Filed: February 3, 2014
    Publication date: December 24, 2015
    Inventors: KAZUO GODA, TAKUMI TAURA, SHINICHI KISHIMOTO, HIDEKI UEDA, TAKESHI MORI
  • Publication number: 20150260752
    Abstract: An acceleration sensor includes: an X detection portion that detects acceleration in an X direction by swinging a first movable electrode about a pair of beam portions; a Y detection portion that detects acceleration in a Y direction perpendicular to the X direction by swinging a second movable electrode about a pair of beam portions; and a Z detection portion that detects acceleration in a Z direction by moving a third movable electrode, which is held by two pairs of beam portions in parallel in the vertical direction, characterized in that the X detection portion, the Y detection portion and the Z detection portion are arranged in one chip.
    Type: Application
    Filed: September 27, 2013
    Publication date: September 17, 2015
    Inventors: Shinichi Kishimoto, Hideki Ueda, Takumi Taura, Hitoshi Yoshida, Takeshi Mori, Nobuyuki Ibara, Kazuo Goda
  • Publication number: 20140227518
    Abstract: There are provided a process for producing an electrical wire molded body comprising: step I of melting and kneading a polyethylene-based resin (a), a polypropylene-based resin (b), a block copolymer (c) of an aromatic vinyl-based compound and a conjugated diene-based compound and the like, and a silane coupling agent (g), and other components, to produce a silane crosslinkable flame retardant polyolefin (A); step II of melting and kneading a polymer selected from the components (a) to (c) and a silanol condensation catalyst (i), to produce a silanol catalyst rein composition (B); and step III of mixing the components (A) and (B), melt molding the mixture on a conductor and then crosslinking the molded body in the presence of water.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 14, 2014
    Applicant: RIKEN TECHNOS CORPORATION
    Inventors: Shinichi Kishimoto, Shinichi Saito, Hideo Ohsawa
  • Publication number: 20130229193
    Abstract: An electrostatic capacitance sensor 1 includes a semiconductor substrate 4. A first fixing plate 2 is joined to a one-side surface 4a of the semiconductor substrate 4, and a second fixing plate 3 is joined to other-side surface 4b of the semiconductor substrate 4, whereby a space portion S is formed. Then, static electricity suppressing means 70 for suppressing static electricity from being generated in the space portion S is provided in the electrostatic capacitance sensor 1.
    Type: Application
    Filed: March 1, 2013
    Publication date: September 5, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Katsumi KAKIMOTO, Hitoshi YOSHIDA, Nobuyuki IBARA, Shinichi KISHIMOTO, Hideki UEDA, Takeshi OKADA, Takeshi MORI, Masatoshi NOMURA, Jun OGIHARA