Abstract: A method of manufacturing a rigid-flex printed wiring board comprises a first step of forming a substrate composition by attaching adhesive layers to both surfaces of a flexible substrate, a second step of forming notches in portions of each of the rigid substrates which correspond to the boundaries between rigid portions and a flexible portion of a rigid-flex printed wiring board prior to the first step such that neither a plating solution nor an etching solution enters the spaces between the flexible substrate and the rigid substrates from the outer atmosphere of the substrate composition, a third step of forming through holes in the flexible substrate and plating them after the first step, a fourth step of cutting an unwanted peripheral portion of the substrate composition after the third step, and a fifth step of removing portions of each rigid substrate which are disposed between the notches.