Patents by Inventor Shin-ichi Kouno

Shin-ichi Kouno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printable pressure-sensitive adhesive sheet and sealing material containing same
    Patent number: 6440553
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 27, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets thereof, and sealing material, reinforcing sheet, and printable pressure-sensitive adhesive sheet using the same
    Publication number: 20010021451
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher.
    Type: Application
    Filed: January 31, 2001
    Publication date: September 13, 2001
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-Ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto
  • Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets made therefrom, and sealants, reinforcing sheets and pressure-sensitive adhesive sheets for printing produced therefrom
    Patent number: 6218006
    Abstract: A pressure-sensitive adhesive composition, wherein the storage elastic modulus [G′] at room temperature is at least 2×106 dyne/cm2 and the adhesive strength at room temperature is 1 kg/20 mm width or higher. Preferably, a pressure-sensitive adhesive composition comprising a polymer having a polycarbonate structure having a repeating unit represented by the following formula wherein R represents a straight chain or branched hydrocarbon group having from 2 to 20 carbon atoms, a pressure-sensitive adhesive sheet, a sealing material, a reinforcing sheet, and a pressure-sensitive sheet for printing, each having the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: April 17, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka, Waka Hikosaka, Makoto Kojima, Shin-ichi Kouno, Hiroaki Mashiko, Hiroshi Wada, Hiroshi Yamamoto, Yoshikazu Soeda, Naoki Matsuoka, Katsuya Kume, Mitsuo Kuramoto