Abstract: A resin container includes a main body in which a bottom plate, a cylindrical body portion, and a ceiling plate are integrally molded, and a pipe which is inserted into the main body through an outlet port opened on the ceiling plate. The main body includes a recessed portion which is formed on the bottom plate, of which center is not located on a virtual axis line extending from a center of the outlet port in a container height direction, and a gutter-shaped groove portion which is formed on the bottom plate and reaches the recessed portion. The pipe is curved from an upper end to a lower end, and the lower end of the pipe is pressed against a boundary between an inner circumferential surface of the recessed portion at a side opposite to a side of the outlet port and a bottom surface of the recessed portion.

Abstract: A method for electrically testing integrated circuits in a wafer comprises the steps of forming a layer of material (20) on the surface of the wafer having a dielectric constant which simulates the dielectric constant of the packaging material which will eventually encapsulate the integrated circuits. In one embodiment, photoresist is formed on the integrated circuit prior to wafer test. In this way, during wafer test, the capacitive coupling between the conductive structures (14) in the integrated circuit will accurately simulate the capacitive coupling between these structures after the integrated circuit is encapsulated in the packaging material.