Patents by Inventor Shinichi Nakamata

Shinichi Nakamata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9281194
    Abstract: An ohmic electrode (6) of a silicon carbide semiconductor apparatus is fabricated by forming an ohmic metal film on a silicon carbide substrate (1) by sputtering a target including a mixture or an alloy having therein nickel, and a metal(s) reducing the magnetic permeability of nickel and producing a carbide, where compositional ratios of the mixture or alloy are adjusted to predetermined compositional ratios, and by executing heat treatment for the ohmic metal film to calcinate the ohmic metal film. Thus, the ohmic electrode (6) that is for the silicon carbide semiconductor apparatus and capable of improving the use efficiency of the target can be manufactured, whose film thickness is even and that does not peel off.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: March 8, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Mina Ryo, Shinichi Nakamata, Akimasa Kinoshita, Kenji Fukuda
  • Publication number: 20150194313
    Abstract: An ohmic electrode (6) of a silicon carbide semiconductor apparatus is fabricated by forming an ohmic metal film on a silicon carbide substrate (1) by sputtering a target including a mixture or an alloy having therein nickel, and a metal(s) reducing the magnetic permeability of nickel and producing a carbide, where compositional ratios of the mixture or alloy are adjusted to predetermined compositional ratios, and by executing heat treatment for the ohmic metal film to calcinate the ohmic metal film. Thus, the ohmic electrode (6) that is for the silicon carbide semiconductor apparatus and capable of improving the use efficiency of the target can be manufactured, whose film thickness is even and that does not peel off.
    Type: Application
    Filed: March 18, 2013
    Publication date: July 9, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mina Ryo, Shinichi Nakamata, Akimasa Kinoshita, Kenji Fukuda
  • Patent number: 8605377
    Abstract: A low-cost, high-definition color conversion layer is made using the ink jet method, with the layer having a consistent thickness and not bleeding into adjacent subpixels. A color conversion filter (1000) is characterized by being formed with a bank layer (60) that has a plurality of gently-curved protrusions (63), each of which has a first portion (61) and a second portion (62).
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: December 10, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinichi Nakamata, Naoyuki Kanai
  • Publication number: 20110038070
    Abstract: A method is disclosed for creating a low-cost, high-definition color conversion layer using the ink jet method, with the layer having a consistent thickness and not bleeding into adjacent subpixels. A color conversion filter (1000) is characterized by being formed with a bank layer (60) that has a plurality of gently-curved protrusions (63), each of which has a first portion (61) and a second portion (62).
    Type: Application
    Filed: March 27, 2009
    Publication date: February 17, 2011
    Applicant: FUJI ELECTRIC HOLDINGS CO.,LTD.
    Inventors: Shinichi Nakamata, Naoyuki Kanai
  • Patent number: 5518432
    Abstract: A method for manufacturing a thin-film EL device utilizes a Zn-Mn target that contains less Mn than the optimum Mn concentration on the basis of the finding that the light-emitting layer grown by the sputtering method contains more Mn than in the target. Manganese concentration on the target surface layer is controlled by changing the area ratio between ZnS and Mn exposed on the surface of the target. Manganese concentration on the target surface is controlled at preferably from 0.3 to 0.4 wt % when the target surface is sulfurized during sputtering and less than 0.1 wt % when the target surface is not sulfurized.
    Type: Grant
    Filed: June 7, 1994
    Date of Patent: May 21, 1996
    Assignee: Fuji Electric Company, Ltd.
    Inventors: Hisato Katou, Tomoyuki Kawashima, Kazuyoshi Shibata, Harutaka Taniguchi, Shinichi Nakamata
  • Patent number: 4003229
    Abstract: There is described a method for compensating tail end of rolling materials for rolling shaped steel sections in an optimum manner. According to this method, in a continuous tension free rolling operation of a shaped steel section comprising a flat section and a flange section through a plural number of roll stands, the operating speed of a first roll stand is reduced by a predetermined amount as compared with a second or succeeding roll stand when the crop at the tail end of the rolling material enters the first rolling unit, thereby to prevent overfeeding.
    Type: Grant
    Filed: March 26, 1975
    Date of Patent: January 18, 1977
    Assignees: Nippon Steel Corporation, Mitsubishi Electric Corporation
    Inventors: Toshio Harada, Shinichi Nakamata, Shiro Araki, Koei Nakashima, Hironori Kawasaki, Kazuo Watanabe, Keiichi Miura