Abstract: The present invention relates to a method of automatically determining a measurement recipe for a feature, such as a dimension of a pattern formed on a workpiece, such as a wafer, a mask, a panel, or a substrate. This method includes: determining a type of a CAD pattern (101) and a measurement recipe based on a relative position of a measurement point (111) and the CAD pattern (101) on a coordinate system defined in design data, and an area of the CAD pattern (101); aligning a real pattern (121) on an image corresponding to the CAD pattern (101) with the CAD pattern (101); and measuring a feature of the real pattern (121) according to the determined measurement recipe.

Abstract: A method which can generate a clear image of a specimen by correcting an image drift is disclosed. The image generation method includes: scanning a specimen with an electron beam to generate images; calculating amounts of image drift within specific regions of the respective images; calculating continuous amounts of image drift by interpolation from the amounts of image drift; determining an amount of image drift at each pixel of the images from the continuous amounts of image drift; correcting the images by correcting a brightness of each pixel based on the amount of image drift at each pixel; and generating a synthetic image from the corrected images.

Abstract: A method which can generate a clear image of a specimen by correcting an image drift is disclosed. The image generation method includes: scanning a specimen with an electron beam to generate images; calculating amounts of image drift within specific regions of the respective images; calculating continuous amounts of image drift by interpolation from the amounts of image drift; determining an amount of image drift at each pixel of the images from the continuous amounts of image drift; correcting the images by correcting a brightness of each pixel based on the amount of image drift at each pixel; and generating a synthetic image from the corrected images.

Abstract: First imposition data are referred to in order to judge whether or not side stitching is included in a first processing sequence. If it is determined that side stitching is included in the first processing sequence, a job including a printing process and a sheet folding process is defined with respect to each signature to be side-stitched. Print data corresponding to a second sheet are generated with respect to each job.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing edges of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device for generating a reference pattern represented by one or more lines from design data, an image generation device for generating the image of the pattern to-be-inspected, a detecting device for detecting an edge of the image of the pattern to-be-inspected, and an inspection device for inspecting the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected.

Abstract: A fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data is inspected by a pattern inspection apparatus. The pattern inspection apparatus for inspecting a pattern to-be-inspected uses an image of the pattern to-be-inspected and data for fabricating the pattern to-be-inspected.

Abstract: A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device for generating a reference pattern represented by one or more lines from design data, an image generation device for generating the image of the pattern to-be-inspected, a detecting device for detecting an edge of the image of the pattern to-be-inspected, and an inspection device for inspecting the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.

Abstract: A method of disposing of combustible materials. The method includes the steps of: providing a heating space; providing a first source to generate heat to a first predetermined level at a first location in the heating space sufficient to reconstitute the combustible materials to a molten slag at the first location and so that heat generated by the first source elevates the temperature at a second location within the heating space to a second predetermined heat level that is below the predetermined heat level and high enough to cause combustion of the combustible materials; directing combustible materials to the second location at which the combustible materials are combusted to produce ash; and causing the ash to be directed to the first location to be reconstituted as molten slag.