Abstract: An I/O unit comprises: a plurality of first-stage-side terminals for connecting to a master unit or another I/O unit; a plurality of second-stage-side terminals that are provided in order to connect to the other I/O unit, and are connected to mutually distinct first-stage-side terminals; and a slave process circuit that performs signal processing and is connected to one of the plurality of first-stage-side terminals and to the second-stage-side terminal connected to that first-stage-side terminal.

Abstract: An I/O unit comprises: two front-stage terminals; a slave processing circuit; two rear-stage terminals; and a selection circuit for selecting whether to connect the front-stage terminal and the rear-stage terminal, and the front-stage terminal and the rear-stage terminal, or to connect the front-stage terminal and the rear-stage terminal, and the front-stage terminal and the rear-stage terminal. The selection circuit connects to the rear-stage terminal via the slave processing circuit.

Abstract: An electronic apparatus for inputting and outputting signals is provided with a plurality of processing circuits for inputting and outputting signals, a plurality of common power terminals connected to different processing circuits to supply power to each of the plurality of processing circuits, a plurality of individual power terminals connected to different processing circuits to supply power to each of the plurality of processing circuits, and a conductive member which is detachably provided and electrically connects the plurality of common power terminals.

Abstract: A master unit for transmitting signals to devices connected to I/O units is divided into: a connector module having a first connector and a main module having a master processing circuit, a second connector, a branch terminal, and a power supply part. The second connector and the master processing circuit are connected by first connection terminals provided to the connector module and the main module.

Abstract: An I/O unit comprises: a preceding stage-side mainstream terminal and a preceding stage-side branch terminal that are connected to preceding-stage master units; a next stage-side branch terminal that is connected to the preceding-stage branch terminal and connected to another I/O unit; a slave processing circuit that is connected to the preceding stage-side branch terminal and the next stage-side branch terminal; and a next stage-side mainstream terminal connected to the preceding stage-side mainstream terminal and a master unit in the next stage.

Abstract: An I/O unit transmits signals between a master unit and instruments. The master unit has two redundant master processing circuits. The I/O unit includes: a first slave processing circuit that performs input and output of signals with respect to one of the two master processing circuits; and a second slave processing circuit that performs input and output of signals with respect to the other one of the two redundant master processing circuits.

Abstract: A master unit that transmits a signal with a device via an I/O unit comprises: a connector module having a first connector and a power source unit; and a signal processing module having a branch terminal and a master processing circuit. The connector module and the signal processing module further comprise connection terminal units that connect the first connector and the power source unit with the master processing circuit.

Abstract: A semiconductor apparatus including: a first substrate; a first wiring structure; a second substrate; and a second wiring structure, wherein the first wiring structure has a first wiring layer bonded to wiring of the second wiring structure, a second wiring layer connected to the first wiring layer by a first via, and a third wiring layer connected to the second wiring layer by a second via, at least part of the second via is located at a range distanced, by at least a width of the first via, from an axis of the first via, a thickness of the second wiring layer is less than the width of the first via, a major constituent of the first wiring layer, the second wiring layer and the first via is copper, and a layer that is made from a material different from copper is disposed between the first via and the second wiring layer.

Abstract: A semiconductor apparatus including: a first substrate; a first wiring structure; a second substrate; and a second wiring structure, wherein the first wiring structure has a first wiring layer bonded to wiring of the second wiring structure, a second wiring layer connected to the first wiring layer by a first via, and a third wiring layer connected to the second wiring layer by a second via, at least part of the second via is located at a range distanced, by at least a width of the first via, from an axis of the first via, a thickness of the second wiring layer is less than the width of the first via, a major constituent of the first wiring layer, the second wiring layer and the first via is copper, and a layer that is made from a material different from copper is disposed between the first and second wiring layers.

Abstract: Disclosed are a terminal allowing work for attaching the cap to the insertion part to eliminate, and to provide in a short time the cap to the insertion part, and a method of forming the cap of the terminal. In a terminal, at a tip end of a tubular insertion part a resin made cap is provided, the insertion part includes an annular portion with narrower diameter than that the insertion part at a tip end thereof, the cap is disposed at the insertion part by a dipping work covering the annular portion in an inner side away from a tip end of the insertion part past the annular portion.

Abstract: Disclosed are a terminal allowing work for attaching the cap to the insertion part to eliminate, and to provide in a short time the cap to the insertion part, and a method of forming the cap of the terminal. In a terminal, at a tip end of a tubular insertion part a resin made cap is provided, the insertion part includes an annular portion with narrower diameter than that the insertion part at a tip end thereof, the cap is disposed at the insertion part by a dipping work covering the annular portion in an inner side away from a tip end of the insertion part past the annular portion.

Abstract: An object is to provide a waterproof connector which can prevent an electric wire from being removed and which can reduce number of components, An engagement hole is provided at a housing portion of a housing, and a lance is provided at a rubber stopper containing resin. When the lance and the engagement hole are engaged to each other, the rubber stopper containing resin is fixed within the housing.

Abstract: An optical disc includes a data area for recording a plurality of video segments and an index area from recording original type chain information and user-defined type chain information. The original type chain information defines an original type chain including first ones of the video segments by describing a reproduction order of the first video segments. The user-defined type chain information defines a user-defined type chain including second ones of the video segments by describing a reproduction order of the second video segments. The first video segments are positioned in the data area in the reproduction order of the first video segments whereas the second video segments are positioned in the data area independently of the reproduction order of the second video segments.

Abstract: A method for fabricating a glass substrate containing SiO2 as a main ingredient thereof for an information recording medium which ensures removal of abrasive or foreign mater adhered to the glass substrate without complicating a cleaning step, involves, after a polishing step, keeping the surface of the glass substrate in contact with a liquid having a Si element elution in a range from 100 to 10 000 ppb/mm2 before a scrub-cleaning step.

Abstract: A method for cleaning a glass substrate which ensures removal of abrasive and other foreign matter without making a cleaning step complicated involves cleaning the glass substrate by scrubbing using two or more types of cleaning liquid having different Si element elution abilities. The cleaning liquid having the highest Si element elution is used first, and the cleaning liquid having the lowest Si element elution is used last.

Abstract: A multimedia optical disc for recording main video data which is composed of sets of frame data that is processed beforehand to allow compatibility with displays of a plurality of aspect ratios. The disc has a stream area storing streams made up of the main video data and a plurality of sets of sub-picture data, with each set of sub-picture data including a set of tel-op data and a set of coordinate information showing a display position of the set of tel-op data. The disc also includes a control area storing a plurality of pairings of a set of display mode information and a set of sub-picture indicating information. Each set of display mode information shows a species of display method according to which the frame data is to be processed for a case when the frame data decoded from the main video data is displayed at one of the plurality of aspect ratios.

Abstract: A reproduction route composed of a still image section and a motion image section is recorded on a recordable DVD. A drive device (93) reads picture data from the DVD-RAM. An MPEG decoder (95) decodes and displays the read picture data. By referring to cell information, the judgment is performed as to whether the read picture data belongs to the still image section or the motion image data. If the read picture data belongs to the still image section, the next picture data is read out after a predetermined wait time.

Abstract: A method for manufacturing a glass substrate for an information recording medium, wherein the abrasive and foreign matters adhered on the glass substrate after the polishing step are surely removed without making the cleaning step complicated. The glass substrate is cleaned by scrubbing with water to which 0.5-5.0 mass % of hydrogen peroxide has been added as a cleaning solution.