Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.

Abstract: The invention is a composite sheet used to bond semiconductor elements and circuit substrates together, containing a resin with magnetic and conductive particles. The invention includes processes for making the sheet and for using the sheet. The sheet includes a binder which contains photocuring and thermosetting components, and a fibrous filler which is both conductive and magnetic. A semicured conductive sheet can be obtained by light irradiation of the sheet. Thermocompression can be used for producing a semiconductor package. Reductions in conductive part pitch are achieved by adhering a noble metal onto the surface of the sheet. Thermal conductivity can be improved by inclusion of a filler having high thermal conductivity. Projections of binder containing magnetic fibrous fillers allows stable electrical conduction. Dispersion of fine particles in the binder inhibits deterioration of the sheets insulating abilities.

Abstract: A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.

Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R1, R2, R5, and R6 are an alkyl group , R3 and R7 are a hydroxyl group or —OR4 (wherein R4 is an organic group), A1− and A2− indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): 1

Abstract: A reflection-preventing film-forming composition including a copolymer having structural units represented by the following general formulas (1) and (2) and a solvent: wherein R1 represents a hydrogen atom, a halogen atom, a hydrocarbon group, etc.; R2 represents a hydrogen atom or a methyl group; and m represents an integer of 1 to 9; wherein R3 represents a hydrogen atom or a methyl group, and R4 represents a hydrogen atom or an organic group. Reflection-preventing films formed of this composition have a high reflection-preventing effect, may cause no intermixing with the resist, have a high etching rate and also can form a resist pattern having superior resolution and precision.

Abstract: A radiation sensitive resin composition comprising (A) a copolymer possessing recurring units of the formulas (1), (2), and (3), which turns alkali soluble in the presence of acid and (B) a photosensitive acid generator. Because the composition can resolve line-and-space patterns, isolated patterns, and contact hole patterns with satisfactory appearance and high resolution, it is useful as a chemically amplified positive resist for use in the manufacture of semiconductor devices.

Abstract: A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R1, R2, R5, and R6 are an alkyl group, R3 and R7 are a hydroxyl group or —OR4 (wherein R4 is an organic group), A1− and A2− indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.

Abstract: A radiation-sensitive resin composition including (A) an alkali-soluble novolak resin obtained by condensing a particular combination of a first phenol having formula: wherein R1 and R2 are the same or different and each represent an alkyl group, a cycloalkyl group, an alkoxyl group or an aryl group; and a second phenol selected from the group consisting of phenol, o-cresol, m-cresol, p-cresol, 2,3-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, resorcinol, 2-methylresorcinol, 4-ethylresorcinol, hydroquinone, methylhydroquinone, catechol, 4-methyl-catechol, pyrogallol, phloroglucinol, thymol and isothymol with an aldehyde in the presence of an acidic catalyst; and (B) a quinonediazidosulfonic acid ester compound. This composition exhibits good resolution, developability, heat resistance, pattern shape, exposure margin and focal latitude in a well balanced state.

Abstract: A novel diazodisulfone compound capable of generating acid having high sensitivity to far ultraviolet rays typified by a KrF excimer laser and the like and capable of providing a resist with superior resolution and patterns when used as a photoacid generator for a chemically amplified resist, and a radiation-sensitive resin composition comprising the diazodisulfone compound. The diazodisulfone compound is represented by the following formulas (1) and (2). ##STR1## The radiation-sensitive resin composition comprises the diazodisulfone compound and resin represented by 4-hydroxystyrene/4-(1'-ethoxyethoxy)styrene copolymer.

Abstract: Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of "nano-edge roughness" or "coating surface roughness". The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising "a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150.degree. C. or higher", and "a compound that upon exposure to radiation generates an acid other than a carboxylic acid". The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) a cross-linking agent, and the component (B) as described above.

Abstract: A radiation-sensitive resin composition comprising (A) a copolymer which comprises (a) a repeating unit (I) formed by cleavage of a carbon--carbon double bond of a monomer having one polymerizable carbon--carbon double bond and (b) a repeating unit (II) formed by cleavage of a carbon--carbon double bond of a monomer having two or more polymerizable carbon--carbon double bonds and at least one divalent group decomposed by an acid of the following formulas (1) or (2), ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are an alkyl group having 1-5 carbon atoms or an aryl group having 6-14 carbon atoms individually, said monomer having a structure in which each carbon--carbon double bond combines via said divalent group, and (B) a photoacid generator.

Abstract: A radiation-sensitive resin composition including an alkali soluble resin and a quinonediazide compound is provided. The quinonediazide compound has the formula (1), for example: ##STR1## wherein, R.sup.1 to R.sup.6 are an alkyl, cycloalkyl or aryl group; a and b are an integer of 1 to 3; D.sup.1 and D.sup.2 are independently a hydrogen atom or a 1,2-quinonediazidosulfonyl group, provided that at least one of D.sup.1 is a 1,2-quinonediazidosulfonyl group; A is a bonding such as single bond; and x and y are an integer of 0 to 2. The composition is suitable as a positive resist, which effectively restrains the occurrence of scum, and excellent in developability, pattern shape, sensitivity, resolution and focus latitude.

Abstract: A radiation sensitive resin composition useful as a chemically amplified positive tone resist is provided. The composition comprises (A) a copolymer which becomes soluble in an alkali developing solution by the action of an acid, the copolymer containing a recurring unit (I) having a structure which is decomposed by the action of an acid and increases the solubility in an alkaline developing solution and a recurring unit(II) obtained from a compound having at least two (meth)acryloyl groups in the molecule by the cleavage of the carbon-carbon double bond, and (B) a photoacid generator which produces an acid on being irradiated by a radiation. The composition exhibits high resolution, superb capability of producing superior pattern forms, and excellent resistance to PED, and high process stability, is affected by a standing wave only to a minimum extent, and possessed prominent heat resistance.

Abstract: A positive-tone or negative-tone radiation sensitive resin composition which allows easy preparation of a resist, exhibits superior storage stability, high sensitivity, and high resolution capability, and is capable of producing excellent resist patterns. The positive-tone type composition comprises (A) a disulfonylmethane derivative in which the main chain with two sulfonyl groups bonded forms a three to eleven member cyclic carbon structure and (B) (a) a resin protected by an acid decomposable group or (b) an alkali-soluble resin and an alkali-solubility control agent. The negative-tone type composition comprises the component (A), (C) an alkali-soluble resin, and (D) a cross-linking agent.

Abstract: A paper coating composition which comprises as a binder a latex of a copolymer (referred to hereinafter the particle A) consisting of (a) 20 to 80% by weight of an aliphatic conjugated diene monomer unit, (b) 0.5 to 10% by weight of an ethylenically unsaturated carboxylic acid monomer unit and (c) 20 to 79.5% by weight of a unit of another monomer copolymerizable with the above components (a) and (b) and having two glass transition points in the range of from -100.degree. C. to 50.degree. C. the difference between the two transition points being at least 5.degree. C.

Abstract: A conjugated diene copolymer comprising (A) 10 to 60 mole % of a conjugated diene compound unit, (B) 5 to 50 mole % of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid unit, (C) 0.1 to 20 mole % of a polyfunctional alkenyl compound unit, (D) 0 to 10 mole % of a diene compound unit having cyclic carbon-carbon double bonds and (E) 0 to 80 mole % of a monoolefinically unsaturated compound unit, the sum of the amounts of units (A), (B), (C), (D) and (E) being 100 mole %, said copolymer having an intrinsic viscosity [.eta.] of 0.01 to 3.0 dl/g as measured at 30.degree. C. in dimethylformamide. The copolymer is soluble in aqueous alkali solutions, excels in processability and photosetting property, and has excellent rubber elasticity and transparency even after photosetting.

Abstract: A conjugated diene copolymer comprising (A) 40 to 90 mole % of a conjugated diene component, (B) 0.5 to 10 mole % of an alpha,beta-ethylenically unsaturated carboxylic acid component, (C) 0.1 to 5 mole % of a polyfunctional alkenyl compound component and (D) 5 to 58 mole % of a monoolefinically unsaturated compound component wherein the intrinsic viscosity [.eta.] of the copolymer as measured at 30.degree. C. in dimethylformamide is 0.01 to 3.0 dl/g, the width (.DELTA.Tg) of the endothermic transition temperature section determined by a differential scanning calorimetry is 45.degree. to 120.degree. C., and the limit temperature (T.sub.1) on the lower temperature side of the endothermic transition temperature section is -40.degree. C. or less.

Abstract: A conjugated diene copolymer comprising (A) 40 to 90 mole % of a conjugated diene component, (B) 0.5 to 10 mole % of an alpha,beta-ethylenically unsaturated carboxylic acid component, (C) 0.1 to 5 mole % of a polyfunctional alkenyl compound component and (D) 5 to 58 mole % of a monoolefinically unsaturated compound component wherein the intrinsic viscosity [.eta.] of the copolymer as measured at 30.degree. C. in dimethylformamide is 0.01 to 3.0 dl/g, the width (.DELTA.Tg) of the endothermic transition temperature section determined by a differential scanning calorimetry is 45.degree. to 120.degree. C. and the limit temperature (T.sub.1) on the lower temperature side of the endothermic transition temperature section is -40.degree. C. or less.

Abstract: A resin composition comprising 100 parts by weight of a thermosetting resin and 1 to 100 parts by weight of a functional, rubbery copolymer containing among the monomer units which constitute the copolymer, at least one monomer containing a substituent selected from the group consisting of epoxy, hydroxyl, carboxyl and amino groups, said copolymer being prepared by one of three emulsion polymerization processes in which a nonionic surface active agent and/or ionic surface active agent is employed as the emulsifying agent.