Abstract: The present invention discloses a polyimide film for metal lamination, which is obtained by providing at least one surface of a heat-resistant polyimide layer with a metal bonding layer. This polyimide film has a 5% weight loss temperature of 500° C. or higher in a nitrogen atmosphere, while having a dielectric loss tangent of 0.007 or less at a frequency of 11.4 GHz. It is preferable that the metal bonding layer is formed of a thermally fusible polyimide, or is formed of a heat-resistant polyimide and a silane coupling agent. The present invention also discloses a polyimide metal laminate which is obtained by additionally laminating a metal layer on a surface of the above-described polyimide film for metal lamination, said surface having been provided with the metal bonding layer.

Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.

Abstract: A polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing a triazine compound used for manufacturing the polyimide precursor, polyimide film and polyimide.

Abstract: A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.

Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI): in which A is tetravalent aromatic group or aliphatic group, B is divalent aromatic group, and each R2 independently represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, in which B in general formula (AI) includes a triazine moiety represented by following formula (AB1): in which R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms or an aromatic group, and R3 represents hydrogen, methyl or ethyl.

Abstract: A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.

Abstract: Disclosed are a polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing triazine compound used for manufacturing these. The polyimide precursor contains a structural unit represented by general formula (I): in which A is a tetravalent aromatic group or aliphatic group and B is a divalent aromatic group, wherein B in general formula (I) comprises a triazine moiety represented by following formula (B1): in which R1 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms, and R2 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms.

Abstract: Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.

Abstract: A polyimide film having improved adhesiveness is produced by flow-casting a solution of a polyamic acid, which is prepared by reacting a tetracarboxylic acid component and a diamine component, on a support, and drying the solution to form a self-supporting film; applying a solution containing a surface treatment agent to one side or both sides of the self-supporting film, wherein the solvent of the surface treatment agent solution is a water-soluble liquid and has a surface tension of 32 mN/m or less at 20° C. and a boiling point of 125° C. or higher; and heating the self-supporting film to provide a polyimide film.