Abstract: A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness.

Abstract: The present invention discloses an improved front removable expansion card module structure applied to an electronic device and comprising: a casing, a cover panel disposed at the top of the casing, an opening formed on a lateral side of the casing, an adapter frame contained in the opening and having a second adaptor interface inserted into a first slot of the first adaptor interface erected in the casing; and one or more second slots formed on the second adaptor interface and parallel to the opening, such that users simply need to pull the adapter frame from the opening to separate the second adaptor interface from the first slot, and then draw the adapter frame to the outside completely for maintenance and repair, without the need of removing the cover panel from the casing, so as to provide a very convenient application.

Abstract: A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness.