Patents by Inventor Shin Kan

Shin Kan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160058181
    Abstract: A delivery container equipped with a lock device, temperature regulating device, sensors and a processor is configured to receive and further store goods without the presence of an owner. The owner is notified by a user device when a delivery is made. The door of the delivery container is opened when a valid passcode is entered. The temperature regulating device heats or cools the interior space of the container, whereby the temperature of the interior space may be automatically determined or manually adjusted. A user via a user device can also communicate with the delivery container to send delivery instructions. The processor of the container is configured to calculate cooling and heating rates and controls the overall operations of the delivery container.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 3, 2016
    Inventors: Qing HAN, Sai Karun GURRAPPADI, Shin Kan Kent NG, Peter Jiayu LIU, Knut Auvor GRYTHE
  • Publication number: 20100175834
    Abstract: A wafer splitting laminate mechanism mounted onto a wafer spitting machine to anchor a wafer includes a cantilever bar, an activating mechanism and a suppressing element. The activating mechanism is fixedly located on the wafer splitting machine to connect and drive the cantilever bar to move. The suppressing element is located at one end of the cantilever bar. The wafer is held by a fixed clip and positioned on a work station of the wafer splitting machine. During preparing the wafer splitting process, the activation mechanism drives the cantilever bar to move and suppress the wafer before the splitting process is performed. Thus warping of the wafer can be reduced during the splitting process.
    Type: Application
    Filed: January 13, 2009
    Publication date: July 15, 2010
    Inventor: Shin-Kan LIU
  • Publication number: 20070102327
    Abstract: The present invention discloses a sorting apparatus for the high voltage test of chip capacitors, which comprises: an align/position module, a sucker/transport module, a clamp/test module, and a diverter/store module, wherein the align/position module can simultaneously align multiple chip capacitors; the sucker/transport module can simultaneously suck the multiple chip capacitors and sends them to the clamp/test module for testing; and then, the diverter/store module can separate the chip capacitors according test results. In the present invention, in addition to that multiple chip capacitors can be tested simultaneously, the sucker/transport module can also simultaneously suck the next batch of chip capacitors ready for testing when the clamp/test module are testing the chip capacitors; therefore, the present invention can sort chip capacitors rapidly and promote the sort efficiency.
    Type: Application
    Filed: December 20, 2005
    Publication date: May 10, 2007
    Inventors: Ming-Tsan Tseng, Shin-Kan Liu
  • Patent number: D960841
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 16, 2022
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Shin Kan
  • Patent number: D961524
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 23, 2022
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Shin Kan
  • Patent number: D985510
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: May 9, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Shin Kan, Toshiro Kobuchi
  • Patent number: D985511
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: May 9, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Shin Kan, Toshiro Kobuchi
  • Patent number: D1034472
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: July 9, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan
  • Patent number: D1037171
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: July 30, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan
  • Patent number: D1037172
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: July 30, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan
  • Patent number: D1037173
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: July 30, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan
  • Patent number: D1037174
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: July 30, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan
  • Patent number: D1037175
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: July 30, 2024
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Shin Kan