Abstract: A wafer splitting laminate mechanism mounted onto a wafer spitting machine to anchor a wafer includes a cantilever bar, an activating mechanism and a suppressing element. The activating mechanism is fixedly located on the wafer splitting machine to connect and drive the cantilever bar to move. The suppressing element is located at one end of the cantilever bar. The wafer is held by a fixed clip and positioned on a work station of the wafer splitting machine. During preparing the wafer splitting process, the activation mechanism drives the cantilever bar to move and suppress the wafer before the splitting process is performed. Thus warping of the wafer can be reduced during the splitting process.

Abstract: The present invention discloses a sorting apparatus for the high voltage test of chip capacitors, which comprises: an align/position module, a sucker/transport module, a clamp/test module, and a diverter/store module, wherein the align/position module can simultaneously align multiple chip capacitors; the sucker/transport module can simultaneously suck the multiple chip capacitors and sends them to the clamp/test module for testing; and then, the diverter/store module can separate the chip capacitors according test results. In the present invention, in addition to that multiple chip capacitors can be tested simultaneously, the sucker/transport module can also simultaneously suck the next batch of chip capacitors ready for testing when the clamp/test module are testing the chip capacitors; therefore, the present invention can sort chip capacitors rapidly and promote the sort efficiency.