Patents by Inventor Shin Keun KIM

Shin Keun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130715
    Abstract: In order to detect medical indices in a medical image, a method of obtaining information from a medical image may include performing segmentation on regions of a heart in the medical image, generating at least one reference line based on the segmentation and determining at least one medical index based on the at least one reference line.
    Type: Application
    Filed: February 24, 2022
    Publication date: April 25, 2024
    Inventors: Se Keun KIM, Hack Joon SHIM, Young Taek HONG, Seong Min HA, Shin Hee MAENG
  • Patent number: 11958874
    Abstract: According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1: In Chemical Formula 1, L1 and L2 are each independently selected from an alkoxy group having 1 to 10 carbon atoms and an alkylamino group having 1 to 10 carbon atoms, R1 is a substituted or unsubstituted aryl group having 6 to 8 carbon atoms, and R2 is selected from a substituted or unsubstituted linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an allyl group having 2 to 4 carbon atoms.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: April 16, 2024
    Assignees: EGTM Co., Ltd., SK hynix Inc.
    Inventors: Jang Keun Sim, Sung Jun Ji, Tae Young Lee, Shin Beom Kim, Sun Young Baik, Tae Hwan Lim, Dong Kyun Lee, Sang Hyun Lee, Su Pill Chun
  • Publication number: 20230178682
    Abstract: A structure including quantum dots formed in a surface control region, a method of forming a structure including quantum dots in a surface control region, a surface-controlled substrate provided with the structure including quantum dots, and a photoelectronic element using the same. The method includes forming multiple surface control layers that differ in etch resistance on a substrate, securing a surface control region on the substrate by forming control patterns having respectively different sizes in the respective surface control layers depending on the etch resistance values through an exposure process, forming the structure including quantum dots in the surface control region by using the plurality of surface control layers as masks, and removing the surface control layers.
    Type: Application
    Filed: August 4, 2021
    Publication date: June 8, 2023
    Inventors: Hyeong Ho Park, Eunjeong Youn, Hae-Yong Jeong, Sang Hyun Jung, Yu Min Ko, Chan Soo Shin, Shin Keun Kim
  • Patent number: 11276603
    Abstract: A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: March 15, 2022
    Assignee: LC SQUARE CO., LTD.
    Inventors: Je Hyuk Choi, Chang Wan Kim, Chan Soo Shin, Hyeong Ho Park, Shin Keun Kim
  • Publication number: 20200321234
    Abstract: A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: LC SQUARE CO., LTD.
    Inventors: Je Hyuk CHOI, Chang Wan KIM, Chan Soo SHIN, Hyeong Ho PARK, Shin Keun KIM