Patents by Inventor Shin-Ki Lee

Shin-Ki Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing capacitor-embedded printed circuit board (PCB)
    Publication number: 20050108874
    Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed wherein a RCC with a resin thickness of several tens of micrometers and another RCC or a PREPREG with a copper foil is used for the embedded capacitor. The present invention eliminates the problem of losing a thermal pad of the upper electrode or the ground pad during the etching step of the outer layer. The present invention makes it possible to minimize the manufacturing tolerance due to the reduction of the beam size of a laser drilling and thereby to increase work efficiency.
    Type: Application
    Filed: October 25, 2004
    Publication date: May 26, 2005
    Inventors: Shin-Ki Lee, Young-Joo Ko