Patents by Inventor Shin Kyung Kim
Shin Kyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142254Abstract: Disclosed is an image processing method. The method includes the steps of receiving an image obtained from a plurality of vehicles positioned on a road, storing the received images according to acquisition information of the received images; determining a reference image and a target image based on images having the same acquisition information among the stored images, performing an image registration using a plurality of feature points extracted from each of the determined reference image and target image, performing a transparency process for each of the reference image and the target image performed with the image registration, extracting static objects from the transparency-processed image, and comparing the extracted static objects with objects on an electronic map pre-stored to updating the electronic map data, when the objects on the electronic map data pre-stored are different from the extracted static objects.Type: ApplicationFiled: January 10, 2024Publication date: May 2, 2024Applicant: THINKWARE CORPORATIONInventors: Ki Wook Lee, Hye Kyung Byun, Tae Kyu Han, Shin Hyoung Kim, Jeong Kyu Kang
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Patent number: 11937765Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.Type: GrantFiled: December 12, 2019Date of Patent: March 26, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: See Hyun Kim, In Gyu Choi, Ki Hwan Kwon, Shin Kim, Hyeon Cheol Kim, Do Kyung Lee, Hyun Ju Lee, Yun Soo Jang, Seung Ryong Cha, Jung Gyun Han
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Publication number: 20210016417Abstract: A CMP pad conditioner and method for manufacturing the same. The CMP pad conditioner includes: a metal plate shank, diamond grit particles each having a lower end secured to a surface of the metal plate shank; a plating layer formed on the surface of the metal plate shank and surfaces of lower portions of the diamond grit particles to expose upper portions of the diamond grit particles; and a coating layer deposited over a surface of the plating layer and surfaces of the upper portions of the diamond grit particles.Type: ApplicationFiled: July 15, 2020Publication date: January 21, 2021Inventors: Shin Kyung KIM, Sung Gyu KIM, Dong Youl PARK, Kang Joon KIM, Kyoung Jin KIM, Tae Hyeon KIM
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Patent number: 10632552Abstract: A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.Type: GrantFiled: June 15, 2016Date of Patent: April 28, 2020Assignee: SHINHAN DIAMOND IND. CO., LTD.Inventor: Shin kyung Kim
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Publication number: 20180154471Abstract: A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.Type: ApplicationFiled: June 15, 2016Publication date: June 7, 2018Inventor: Shin kyung KIM
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Publication number: 20180099376Abstract: Disclosed herein is an attachment removing device for a diamond tool used in a machining process such as cutting, grinding, polishing, drilling, or the like, for removing an attachment attached to the diamond tool. The attachment removing device for a diamond tool for removing an attachment attached to the diamond tool includes a cylindrical member; and a plurality of bristles each having one end connected to the cylindrical member.Type: ApplicationFiled: October 5, 2017Publication date: April 12, 2018Inventors: Young Chan PARK, Sung Gyu KIM, Shin kyung KIM
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Publication number: 20160121454Abstract: Provided is a chemical mechanical polishing (CMP) pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ?m are formed.Type: ApplicationFiled: October 6, 2015Publication date: May 5, 2016Inventors: Jun Ho Song, Mun Seak Park, Shin Kyung Kim, Young Hwan Kim, Hyun Woo Lee
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Publication number: 20130225052Abstract: Provided is a chemical mechanical polishing pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ?m are formed.Type: ApplicationFiled: August 11, 2011Publication date: August 29, 2013Applicant: SHINHAN DIAMOND IND. CO., LTD.Inventors: Jun Ho Song, Mun Seak Park, Shin Kyung Kim, Young Hwan Kim, Hyun Woo Lee
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Patent number: 8100997Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.Type: GrantFiled: February 4, 2005Date of Patent: January 24, 2012Assignee: Shinhan Diamond Industrial Co., Ltd.Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
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Publication number: 20110053479Abstract: A method of manufacturing a cutting tool is disclosed. An object of the manufacturing method of a cutting tool is to reduce contamination of an abrasive layer surface, particularly, agglomeration contamination due to slurry by improving hydrophobicity maintaining performance of an abrasive layer. A cutting tool according to the method of manufacturing comprises an abrasive layer on a base member, the abrasive layer having abrasives bonded to a surface thereof; and a coating on the surface of the abrasive layer that is a hydrophobic material film.Type: ApplicationFiled: May 19, 2008Publication date: March 3, 2011Applicant: SHINHAN DIAMOND IND. CO., LTD.Inventors: Shin Kyung Kim, Kee Jung Cheong, Brian Song, Tae Jin Kim, Mun Seak Park, Byung Ju Min, Jeong Bin Jeon
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Publication number: 20100048112Abstract: Disclosed herein is a diamond tool for cutting a workpiece and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank. The segment includes a tape having a plurality of inserting sections formed on a surface of the tape, and diamond particles inserted into the inserting sections and bonded to the tape by pressure sintering. The inserting sections are formed in the tape corresponding to desired arrangement locations of the diamond particles. The diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows process automation and reduces manufacturing costs.Type: ApplicationFiled: April 23, 2007Publication date: February 25, 2010Applicant: SHINHAN DIAMOND IND. CO., LTD.Inventors: Hyun Woo Lee, Jong Hwan Park, Shin Kyung Kim, Dae Geun Kim
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Publication number: 20100043304Abstract: Disclosed herein is a diamond tool and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank having a compact having a plurality of grooves, and diamond particles inserted into the grooves and bonded to the compact. The grooves can be formed on the compact corresponding to a desired arrangement locations of the diamond particles. A metal powder injection molding method can be employed to prepare the compacts. More than one compact can be stacked to form the segment, so that the diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows cost savings and process automation.Type: ApplicationFiled: April 23, 2007Publication date: February 25, 2010Applicant: SHINHAN DIAMOND IND. CO., LTD.Inventors: Hyun Woo Lee, Jong Hwan Park, Sung Kun Lee, Shin Kyung Kim
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Publication number: 20070151554Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.Type: ApplicationFiled: February 4, 2005Publication date: July 5, 2007Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
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Patent number: 7128066Abstract: Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.Type: GrantFiled: April 28, 2005Date of Patent: October 31, 2006Assignee: Shihan Diamond Industrial Co., Ltd.Inventors: Hwan Chul Lee, Seo Pong Pyun, Sang Do Lee, Byung Lyul Jin, Sang Jin Lee, Tae Ung Um, Yong Seob Shim, Shin Kyung Kim