Abstract: A light emitting diode (LED) has the base of a chip buried in a fluorescent material comprised of fluorescent glue thus to be bonded to a support part; the space between the top layer and support as well as between the peripheral of the chip and a carrier being covered up with powder fluorescent material; the peripherals of the chip being covered up with the powder fluorescent material to balance the incorporation of the wavelength of the light emitted from the top and the peripheral of the chip, and that from fluorescent material to effectively avoid the development of diaphragm in strange color.

Abstract: A manufacturing method and structure of white-light emitting diode. The chip is placed in a diode bowl doped with fluorescent glue. The bowl is then placed in a baking oven. After the baking, gold wire is respectively attached to diode pins on the bird's-eye side of the chip where not doped with fluorescent glue. Finally, the chip is masked with white light insulation glue for baking once more. It facilitates manufacturing process, increases output and improves production QC. Furthermore, the chip does not required conductive silver glue to be baked together in the bowl, so the conductive silver glue will not affect its light emission. The direct emission of color light is effectively prevented since the section not doped with fluorescent glue on the bird's-eye side is masked with white light insulation glue, in turn, light-emitting effect and brightness of white light becomes more stable.